研究開発におけるマルチフィジックスシミュレーションの具体例
さまざまな業界のエンジニア, 研究者, 科学者がマルチフィジックスシミュレーションを使用して革新的な製品の設計とプロセスを研究および開発しています. COMSOL カンファレンスで発表したテクニカルペーパーやプレゼンテーションからインスピレーションを得てください. 以下の選択項目を参照するか, クイック検索ツールを使用して特定のプレゼンテーションを検索するか, アプリケーション領域でフィルタリングします.
COMSOL コンファレンス 2020 論文集を見る
Indoor Thermal Analysis of a Storehouse
The aim of this study is to evaluate the airflow thermal distribution inside a storehouse in different operational conditions. A warehouse of 12,600 m3 in volume is considered for fluid-dynamical and thermal analysis. Coupled Navier-Stokes and energy equations are solved considering or ... 詳細を見る
Influence of Materials and Packaging Solutions on Thermal Behaviour of Power Modules
Nowadays, designing ever more efficient power modules requires complex materials and more innovative methodologies. To significantly reduce the lead time of the devices and decrease the costs, especially during the prototyping and the testing phases, a Finite Element Analysis (FEA) can ... 詳細を見る
Interaction of the Laser with the Material Modelling of the Micro-Lenses Creation
Micro-lenses with potential applications in optics on the surface of the various heavy-metal oxide glasses were created and studied experimentally [1-2]. Laser direct writing using continuous-wave laser emitting at 447 nm was successfully performed [2]. The aim of this study is to ... 詳細を見る
Introducing Kaleidosim cloudCompanion for COMSOL Multiphysics®
To this day seamless accessibility of local or cloud hardware for high performance computing as well as time consuming workflows involving sequencing and orchestration of available hardware for multiple simulation runs, remain limiting factors within the field of Multiphysics simulation ... 詳細を見る
Introduction of a Magneto‐Elastic Constitutive Law in COMSOL Multiphysics® for the Numerical Simulation of a Magneto‐Mechanical Characterization Setup
As part of its research, the Group of Electrical Engineering – Paris (GeePs) uses the COMSOL Multiphysics® software for applications such as material modelling in Electrical Engineering, electromagnetic compatibility and electromagnetic non-destructive testing. Some problems involve ... 詳細を見る
Investigation of Electromigration in Fine-Pitch Copper Interconnects through Simulation and Analysis
The scaling down of Copper interconnects is an effective approach to increasing the number of signal I/O lines and performance in advanced fine-pitch packaging. However, as dimensions are reduced, the risk of electromigration-induced failures in the copper interconnects becomes ... 詳細を見る
Investigation of the Electric Conductivity of an Electrically Heated Reactor
An electrically heated fixed bed (19 mm diameter, 200 mm length) is investigated regarding its electrical conductivity. Various electrically conductive activated carbons are used. The fixed bed is constructed from activated carbon pellets and/or activated carbon fabric. Electrical ... 詳細を見る
Investigations on Talik Formation During Changes to Cold Climates
Over the past million years, several cold ages have occurred and thereby caused perma-frost conditions basically all over the present area of Germany. Since in Germany the safe-ty of a nuclear waste repository legally needs to be investigated for a period of one million years, the ground ... 詳細を見る
Methanation in Catalytic Reactor
Power-to-gas is an important area of research for reducing greenhouse gases and seasonal energy storage. Methane, with a Lower Heating Value of 50 MJ/kg, is already a commonly used gas, and its synthesis using green hydrogen production (electrolysis of renewable energy) is a remarkable ... 詳細を見る
Modeling Electrochemical Deposition of Aluminum from Ionic Liquids for PCB Applications
While copper remains the dominant material for conduction paths in printed circuit board (PCB) applications, both technological and economic reasons have been motivating research on substituting copper with aluminum (Al). Despite its 60 % higher specific electrical resistance, aluminum ... 詳細を見る