COMSOL Day Eindhoven
See what is possible with multiphysics modeling
Modeling and simulation is used for innovation across a range of industries, and this COMSOL Day will highlight some of its many applications.
Keynote speakers from leading Dutch organizations will present real-world examples of multiphysics modeling in research, development, and product design. COMSOL-led sessions will demonstrate the capabilities of COMSOL Multiphysics® for structural mechanics, electromagnetics, CFD, and coupled multiphysics phenomena such as fluid–structure interaction and electromagnetic heating with thermal expansion. There will also be demonstrations of surrogate modeling based on deep neural networks and integration into digital twins.
Additionally, there will be opportunities at this free 1-day event to ask questions and interact with COMSOL applications engineers and simulation experts in the Netherlands.
Schedule
From the Delta Works to semiconductor manufacturing, the Netherlands is famous for its engineering feats, accomplished with ingenuity and forward thinking. During this session, we will go over how the COMSOL Multiphysics® software and its modeling capabilities can be used to help advance innovation in the Netherlands.
Learn the fundamental workflow of COMSOL Multiphysics®. This introductory demonstration will show you all of the key modeling steps, including geometry creation, setting up physics, meshing, solving, and evaluating and visualizing results.
Jos van Schijndel, ASML
In this presentation, Jos van Schijndel will focus on the use of COMSOL Multiphysics® within ASML’s computational modeling Way of Work. He will discuss where computational tools are used in the V-model of systems development at ASML and how the COMSOL® software fits into the main set of ASML computational tools. He will show applications where it is beneficial to use COMSOL Multiphysics®.
Martijn Leskens, Goudsmit Magnetics
In this keynote talk, Martijn Leskens will present on the status of numerous COMSOL finite-element-method-based applications at Goudsmit Magnetics, a Dutch vendor of permanent and electromagnetic systems. The COMSOL Multiphysics® software is used for the design, optimization, and innovation of these systems, which not only involves the finite-element-method-based modeling of permanent and electromagnetic phenomena alone but also involves fluid flow (computational fluid dynamics), structural mechanics, heat transfer, and particle tracing phenomena.
The ability to simulate combinations of these phenomena is considered a particularly important advantage of COMSOL® because of the multiphysics nature of many of Goudsmit’s applications. Both relatively established Goudsmit applications and COMSOL workflows will be discussed, as well as new ones that are still being worked on, with a focus on certain challenges faced in these applications and workflows. Some of the applications considered are in the fields of separation, recycling, handling, and sensing.
This hands-on session is designed for anyone who would like to directly get started with multiphysics modeling. Join us and build your own model from scratch with guidance from a COMSOL engineer. This session is also the perfect opportunity to ask any modeling questions that you may have.
Modeling and simulation is no longer limited to the expertise of a few individuals within an organization. The availability of simulation tools throughout the product or process design workflow — from R&D to the factory floor — allows for a more collaborative and innovative approach to problem solving. Now, even those without prior modeling knowledge can contribute to the process, leveraging the expertise of modeling experts and advanced techniques like digital twins and surrogate models.
To facilitate this collaboration, the Application Builder in the COMSOL Multiphysics® software enables modeling experts to create custom apps with user-friendly interfaces that can be used by scientists and engineers with no modeling experience. Taking it a step further, COMSOL Compiler™ enables organization-wide use of standalone simulation apps without licensing restrictions.
By using the Application Builder and COMSOL Compiler™ together with the COMSOL Multiphysics® platform's built-in Model Builder and Model Manager, engineering organizations can establish an efficient, collaborative, simulation-based environment, supported by the realistic and predictive capabilities of digital twins and surrogate models.
Join this session to learn how the Application Builder and COMSOL Compiler™ can transform your organization's approach to simulation, making advanced tools accessible and fostering a culture of collaborative innovation.
Solver performance becomes increasingly important as physics-based simulation models grow in size and complexity. The COMSOL Multiphysics® software provides a wide selection of solver technologies for stationary and time-dependent problems, nonlinear systems, optimization, and both direct and iterative linear solvers, supporting built-in and user-defined multiphysics couplings for many engineering and scientific applications.
In this session, we will highlight recent solver and performance developments in COMSOL® version 6.4, including support for explicit dynamics formulations for structural analysis, as well as a new NVIDIA CUDA® direct sparse solver (cuDSS) for NVIDIA® GPUs that is generally applicable for any physics. In addition, we will discuss a new mode-following method for parametric eigenfrequency analyses and practical strategies for solving large-scale problems efficiently, including solver selection based on time and memory requirements and the role of hardware factors such as memory bandwidth, processor architecture, and parallelization in overall simulation performance.
In this session, we will demonstrate how to model fluid flow and heat transfer using the CFD Module and the Heat Transfer Module, add-ons to the COMSOL Multiphysics® software. Topics will include laminar and turbulent flow, non-Newtonian fluids, multiphase flow, and flow in microfluidic devices. We will also cover conjugate heat transfer by combining heat transfer in solids and fluids, with optional inclusion of thermal radiation.
These capabilities can be seamlessly extended to multiphysics applications by coupling with structural mechanics for fluid–structure interaction, chemical reactions in reacting flows, and particle tracing.
The COMSOL Multiphysics® platform provides a comprehensive environment for modeling electromagnetics across a wide frequency range and application space. This includes low-frequency field and electromagnetic interference–electromagnetic compatibility (EMI/EMC) analysis, high-frequency RF and microwave device design, wave optics, ray tracing, and electric discharge phenomena. COMSOL Multiphysics®, along with its add-on modules for electromagnetics, is designed to capture the interaction of electromagnetic fields with other physical effects, including thermal, mechanical, fluid, and material behavior, through multiphysics coupling.
This session will provide an overview of the capabilities for modeling electromagnetics using COMSOL Multiphysics® and highlight how simulation supports the design, optimization, and validation of electromagnetic devices and systems.
Structural simulation plays an important role in the design of reliable products and structures by enabling the prediction of deformation, stress and strain levels, vibration behavior, and failure risks before building physical prototypes. The COMSOL Multiphysics® software and its add-on Structural Mechanics Module provide an easy-to-use and complete finite element analysis (FEA) environment for modeling the mechanical behavior of solids and structures, including shells and beams, contact and friction, large deformations, and dynamic response.
In this session, we will provide an overview of the structural analysis capabilities in COMSOL Multiphysics®, including static and transient loading, eigenfrequency and frequency response studies, and a range of nonlinear analyses. We will also highlight how built-in multiphysics couplings and specialized add-ons extend these capabilities to advanced material modeling, fatigue and durability evaluation, composites, and rotating machinery.
Register for COMSOL Day Eindhoven
To register for the event, please create a new account or log into your existing account.
For registration questions or more information contact info-nl@comsol.com.
COMSOL Day Details
Location
Room Ernst-Curie, Room Planck High Tech Campus 1B, The Strip
Eindhoven 5656 AE Directions
For parking information, and the route description, please visit: https://hightechcampus.com/route-description
Keynote Speakers
Jos van Schijndel completed his MSc in 1998 at the Department of Applied Physics at the Eindhoven University of Technology (TUe). In 2007, he obtained his PhD degree from TUe in integrated heat, air, and moisture modeling using MATLAB®, Simulink®, and the COMSOL® software. He worked for more than 25 years at TUe on the physics of the built environment. In 2018, he started as a thermal analyst at ASML. His passion is the computational modeling of high-tech devices using state-of-the-art scientific software and experimental validation.
Martijn Leskens has obtained MSc and PhD degrees, as well as a postdoc, at the Faculty of Mechanical Engineering at the Delft University of Technology, NL. His studies have focused on model-based control, with the most important applications in the fields of municipal solid waste incineration and compact cyclonic separation. For the past 9 years, he has worked for Goudsmit Magnetics, a Dutch vendor of permanent and electromagnetic systems, as a simulation engineer and consultant on various topics involving magnets and magnetic systems.
Previously, he worked as an R&D technologist for 5 years for FMC Separation Systems, part of FMC Technologies, a supplier for the upstream oil and gas industry, in Arnhem, the Netherlands, and before that, he spent 10 years at the Netherlands Organisation for Applied Scientific Research (TNO) at various locations in the Netherlands.
Vignesh Murali works at Smit Thermal Solutions, NL, where he is experienced in multiphysics projects integrating microfluidics, heat and mass transfer, and multiphase flows to advance additive manufacturing. Smit Thermal Solutions specializes in providing cutting-edge equipment for thermal processes and thin film deposition. The company's state-of-the-art equipment platforms have been designed to meet the diverse needs of customers across a range of industries, with a strong emphasis on energy conversion and energy storage applications.
