Multiphysics Modeling of Semiconductors, Part 1: Packaging & Testing

Semiconductor packaging is critical to the development of modern electronic devices, influencing their performance, reliability, and thermal management. The complexity of packaging technologies has grown significantly with the demand for miniaturization, higher power densities, and improved mechanical and thermal robustness. Addressing these challenges requires a comprehensive understanding of the multiphysics interactions within semiconductor packages, including interactions involving electromagnetics, heat transfer, structural mechanics, and fluid dynamics.

In this webinar, we will explore how multiphysics simulation enables engineers to analyze and optimize semiconductor packaging designs, including advanced packaging, under realistic operating conditions.

Using the COMSOL Multiphysics® software, we will showcase a variety of simulation models covering different aspects of semiconductor packaging, such as thermal dissipation strategies, stress analysis, electromigration reliability, and signal integrity. These examples will highlight the benefits of an integrated modeling approach for improving design efficiency and reliability.

Join us to learn how simulation-driven design can accelerate innovation in semiconductor manufacturing. You will also gain insights into best practices for leveraging multiphysics modeling in your development process.

This is the first webinar in a three-part series showcasing the capabilities of COMSOL Multiphysics® relevant to the semiconductor industry.