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In semiconductor manufacturing, vacuum chucks are used to rapidly and contamination-free adsorb and secure wafers before processes such as transfer, lithography, and inspection. Traditional empirical design makes it difficult to quantify the effects of groove shape, size, distribution, and initial wafer warpage on adsorption performance.

This example presents a coupled fluid-structure-contact model that captures the interaction between the pressure distribution in the chuck grooves and wafer deformation during adsorption. The model provides quantitative insight into the chucking mechanism and serves as a basis for optimizing groove design.