アプリケーションギャラリには電気, 構造, 音響, 流体, 熱および化学分野に関連する COMSOL Multiphysics® チュートリアルおよびデモアプリファイルが用意されています. これらの例はチュートリアルモデルまたはデモアプリファイルとそれに付随する手順をダウンロードすることにより独自のシミュレーション作業の開始点として使用できます.
クイック検索機能を使用して専門分野に関連するチュートリアルやアプリを検索します. MPHファイルをダウンロードするには, ログインするか, 有効な COMSOL ライセンスに関連付けられている COMSOL Access アカウントを作成します. ここで取り上げた例の多くは COMSOL Multiphysics® ソフトウェアに組み込まれ ファイルメニューから利用できるアプリケーションライブラリからもアクセスできることに注意してください.
This model uses the Reacting Flow multiphysics interface to simulate a methane steam reformer. The model accounts for the interactions between the chemical reactions, the transport of species, the fluid flow, and the heat transfer in a porous medium. 詳細を見る
Electroless deposition or plating is a non-galvanic plating method that does not require any external electrical power. This technique is typically used for electroless plating of nickel, silver, gold and copper. In electroless deposition, partial oxidation and reduction reactions ... 詳細を見る
The present model example is based on Copper Deposition in a Trench model available in Electrodeposition Application Library. The nonuniform deposition along the trench surface leads to formation of a cavity/void. Since the Deformed Geometry interface cannot handle topological changes, ... 詳細を見る
Lead-acid batteries are widely used as starting batteries for various traction applications such as cars and trucks and so forth. The reason for this is the fairly low cost in combination with the performance robustness for a broad range of operating conditions. However, one drawback of ... 詳細を見る
When anodizing aluminum, the surface is electrochemically altered to form an abrasive and corrosion-resistive Al2O3 film. The electrode kinetics during the process are only marginally affected as the oxide layer grows, so a stationary analysis of the current distribution is sufficient to ... 詳細を見る
Chemical vapor deposition (CVD) is an important step in the process of manufacturing microchips. One common application is the deposition of silicon on wafers in low pressure reactors to obtain uniform deposition thicknesses. This example models the coupled reaction kinetics, fluid ... 詳細を見る
This example models time-dependent copper deposition on a resistive wafer in a cupplater reactor. As the deposited layer builds up, the resistive losses of the deposited layer decreases. The benefit of using a current thief for a more uniform deposit is demonstrated. 詳細を見る
This application demonstrates how you can access and include external thermodynamic and physical property calculations in your simulation, using the Thermodynamics feature. The example shows how you can easily modify the predefined Plug-flow reactor type in the Reaction Engineering ... 詳細を見る
This example models cathodic protection of a steel reinforcing bar in concrete. Three different electrochemical reactions are considered on the steel surface. Charge and oxygen transport are modeled in the concrete domain, where the electrolyte conductivity and oxygen diffusivity depend ... 詳細を見る
This model illustrates the effect of oxygen and hydrogen formation and recombination on the performance and self-discharge of an electrochemical capacitor with a water-based electrolyte. A load cycle consisting of mixed constant current pulses and rest periods at an open circuit is ... 詳細を見る
