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Electrodeposition of an Inductor Coil
This example models the deposition of an inductor coil in 3D. The geometry includes the extrusion of the deposition pattern into an isolating photoresist mask, and a diffusion layer on top of the photoresist. The mass transfer of copper ions in the electrolyte has a major impact on the ... 詳細を見る
Electrodeposition of a Microconnector Bump in 2D
This model demonstrates the impact of convection and diffusion on the transport-limited electrodeposition of a copper microconnector bump (metal post). Microconnector bumps are used in various types of electronic applications for interconnecting components, for instance liquid crystal ... 詳細を見る
Electrodeposition on a Resistive Patterned Wafer
This example models time-dependent copper deposition on a resistive wafer in a cupplater reactor. As the deposited layer builds up, the resistive losses of the deposited layer decreases. The benefit of using a current thief for a more uniform deposit is demonstrated. 詳細を見る
Electrodeposition of a Microconnector Bump with Deforming Geometry in 3D
This model simulates the shape evolution of a microconnector bump over time as copper deposits on an electrode surface. Transport of cupric ions in the electrolyte occurs by convection and diffusion. The electrode kinetics are described by a concentration dependent Butler-Volmer ... 詳細を見る
Fountain Flow Effects on Electrodeposition on a Rotating Wafer
This example extends the analysis made in the model Electrodeposition on a Resistive Patterned Wafer by including the diffusion and convection of copper ions in the electrolyte. The coupled mass transport convection-diffusion effects are of interest in this type of reactor since they ... 詳細を見る
Alloy Deposition
Electrochemical codeposition is a common low-cost method for producing metal alloys. This tutorial model demonstrates electrodeposition of a nickel (Ni)–phosphorous (P) alloy. The model accounts for charge and mass transport of a multitude of species along with multiple electrode ... 詳細を見る
Copper Deposition in a Through-Hole Via
This model demonstrates the "butterfly" filling mechanism for copper electrodeposition in a Through-Hole (TH) via exposed to an electrolyte containing halide-suppressor additives. The Tertiary Current Distribution, Nernst Planck interface in combination with Deformed Geometry is used ... 詳細を見る
Copper Deposition in a Trench
This model demonstrates the use of moving meshes in the application of copper electrodeposition on circuit boards. In these environments, the presence of cavities or 'trenches' are apparent. The model makes use of the Tertiary, Nernst-Planck interface for electrodeposition to keep track ... 詳細を見る
Rotating Cylinder Hull Cell
Rotating cylinder Hull cells are an important experimental tool in electroplating and electrodeposition and are used for the measurement of nonuniform current distribution, mass transport, and throwing power of plating baths. The model reproduces the results for a commercially available ... 詳細を見る
Two-Phase Flow Modeling of Copper Electrowinning Using Bubbly Flow
Copper electrowinning is the process of copper extraction from an electrolyte solution and its deposition at the cathode surface, by passing an external current through the electrolytic cell and using an insoluble anode. During the process, oxygen bubbles are generated at the anode ... 詳細を見る