アプリケーションギャラリには電気, 構造, 音響, 流体, 熱および化学分野に関連する COMSOL Multiphysics® チュートリアルおよびデモアプリファイルが用意されています. これらの例はチュートリアルモデルまたはデモアプリファイルとそれに付随する手順をダウンロードすることにより独自のシミュレーション作業の開始点として使用できます.
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A bipolar membrane consists of one anion-selective, and one cation-selective membrane, in contact with each other. The combined cation and anion selectivity makes the bipolar membrane highly impermeable to all ions, with the exception of H+ and OH- which are formed by water splitting ... 詳細を見る
Electrochemical codeposition is a common low-cost method for producing metal alloys. This tutorial model demonstrates electrodeposition of a nickel (Ni)–phosphorous (P) alloy. The model accounts for charge and mass transport of a multitude of species along with multiple electrode ... 詳細を見る
Electroless deposition or plating is a non-galvanic plating method that does not require any external electrical power. This technique is typically used for electroless plating of nickel, silver, gold and copper. In electroless deposition, partial oxidation and reduction reactions ... 詳細を見る
Digital Rock technology utilizes high-resolution imaging techniques, such as SEM and X-ray CT, to characterize the pore structures of rock cores. This approach enables pore-scale modeling of reservoir rocks, offering valuable insights into pore morphology, connectivity, and fluid ... 詳細を見る
The purpose of this model is to visualize the electric potential in an electrochemical cell, for example a battery. This is done at OCV and during operation. In a battery, this would correspond to OCV, discharge, and recharge. The potential profile is explained both for cells with planar ... 詳細を見る
This example shows how to model secondary current distribution and electrode growth with a moving geometry. To avoid numerical instabilities, a seed layer is introduced in the initial geometry to obtain a right angle at the edge between the growing electrode and the insulator. 詳細を見る
This model demonstrates the impact of convection and diffusion on the transport-limited electrodeposition of a copper microconnector bump (metal post). Microconnector bumps are used in various types of electronic applications for interconnecting components, for instance liquid crystal ... 詳細を見る
The present model demonstrates diffusion-controlled electrodeposition of copper on microstructured band electrode arrays (MEA). Mass transport by Fickian diffusion of copper ions is solved using the Transport of Diluted Species interface. Dendrite formation as a consequence of diffusion ... 詳細を見る
This example extends the analysis made in the model Electrodeposition on a Resistive Patterned Wafer by including the diffusion and convection of copper ions in the electrolyte. The coupled mass transport convection-diffusion effects are of interest in this type of reactor since they ... 詳細を見る
This model file was used for creating the plots featured in the blog post "How to Model Ion-Exchange Membranes and Donnan Potentials". 詳細を見る