アプリケーションギャラリには電気, 構造, 音響, 流体, 熱および化学分野に関連する COMSOL Multiphysics® チュートリアルおよびデモアプリファイルが用意されています. これらの例はチュートリアルモデルまたはデモアプリファイルとそれに付随する手順をダウンロードすることにより独自のシミュレーション作業の開始点として使用できます.
クイック検索機能を使用して専門分野に関連するチュートリアルやアプリを検索します. MPHファイルをダウンロードするには, ログインするか, 有効な COMSOL ライセンスに関連付けられている COMSOL Access アカウントを作成します. ここで取り上げた例の多くは COMSOL Multiphysics® ソフトウェアに組み込まれ ファイルメニューから利用できるアプリケーションライブラリからもアクセスできることに注意してください.
Silicon carbide (SiC) epitaxial furnaces are a specialized equipment for the production and preparation of SiC epitaxial wafers. This example model demonstrates the process of preparing an SiC epitaxial wafer based on the physical vapor transport (PVT) method in a furnace. This involves ... 詳細を見る
This example shows how to set up a glacier flow model in principle, containing several important aspects of glacier modeling: The creation of the 2D geometry, the modeling of non-Newtonian flow, and the implementation of basal sliding. In this example, two different glacier types, a cold ... 詳細を見る
Freeze-drying, or lyophilization, is a process for drying heat-sensitive substances such as foods, blood plasma, and antibiotics. The wet substance is frozen and then, through sublimation, ice (or some other frozen solvent) is removed in the presence of a high vacuum. This example ... 詳細を見る
A 3D model is used to simulate the cooling of a bevel gear from an austenitic state. Phase material properties and phase transformation data are imported into the model. The final phase composition and the residual stress state are computed. Phenomena such as thermal strains, phase ... 詳細を見る
This model demonstrates how to compute satellite temperature over multiple orbit periods by coupling Orbital Thermal Loads to Heat Transfer in Solids. The direct solar, albedo, and Earth infrared thermal loads are computed over a single orbit, and are periodically repeated over multiple ... 詳細を見る
This entry is a compilation of some examples from DIN EN 1991-1-2 (Actions on structures exposed to fire). Models that are included: 1. Cooling (HT) 2. Heating (HT) 3. Heat transfer through multiple layers (HT) 4. Thermal elongation (SME, thermal stress) 5. Thermal expansion (SME, HT, ... 詳細を見る
Ion implantation is used extensively in the semiconductor industry to implant dopants into wafers. Within an ion implanter, ions generated within an ion source are accelerated by an electric field to achieve the desired implant energy. Ions of the correct charge state are selected by ... 詳細を見る
During the design of a building, environmental issues have gained considerable influence in the entire project. One of the first concerns is to improve thermal performances. In this process, simulation software are key tools to model thermal losses and performances in the building. The ... 詳細を見る
During the design of a building, environmental issues have gained considerable influence in the entire project. One of the first concerns is to improve thermal performances. In this process, simulation software are key tools to model thermal losses and performances in the building. The ... 詳細を見る
A 3D model of an acoustic trap in a glass capillary with a bias flow through the capillary. The acoustics is actuated by an oscillating electric potential across a piezoelectric transducer, inducing mechanical vibrations in the solid, and an acoustic pressure field in the fluid. The heat ... 詳細を見る