アプリケーションギャラリには電気, 構造, 音響, 流体, 熱および化学分野に関連する COMSOL Multiphysics® チュートリアルおよびデモアプリファイルが用意されています. これらの例はチュートリアルモデルまたはデモアプリファイルとそれに付随する手順をダウンロードすることにより独自のシミュレーション作業の開始点として使用できます.
クイック検索機能を使用して専門分野に関連するチュートリアルやアプリを検索します. MPHファイルをダウンロードするには, ログインするか, 有効な COMSOL ライセンスに関連付けられている COMSOL Access アカウントを作成します. ここで取り上げた例の多くは COMSOL Multiphysics® ソフトウェアに組み込まれ ファイルメニューから利用できるアプリケーションライブラリからもアクセスできることに注意してください.
In this model you study the force-deflection relation of a car door seal made from a soft rubber material. The model uses a hyperelastic material model together with formulations that can account for the large deformations and contact conditions. 詳細を見る
Concrete structures almost always contain reinforcements in the shape of steel bars ("rebars"). In COMSOL, rebars can be modeled either individually by adding a Truss interface to the Solid interface used for the concrete or using the Fiber subfeature to model their global effect. In ... 詳細を見る
In this example, a torque is applied to the inner edge of a circular annulus-shaped membrane while the outer edge is fixed, resulting in membrane wrinkling. The wrinkling membrane model avoids the equilibrium instability that would be produced by the compressive stresses. The effect of ... 詳細を見る
Crimping is the plastic deformation process used to form an electrical joint between a stranded conductor and a terminal. The process involves complex multi-surface contact, including self-contact, as the terminal sleeve is plastically deformed around the wire strands. This example ... 詳細を見る
This app allows to calculate the absorption coefficient and surface impedance of a sound absorbers for normal and random incidences. The computed quantities can be used when setting up boundary conditions in a Pressure Acoustics, Frequency Domain model or a Ray Acoustics model. The ... 詳細を見る
Reflow soldering is an important process in IC packaging. In reflow soldering, the solder materials are melted to create joints between electrical components and the PCBs for structural and electrical connections. This model demonstrates the process of attaching chips to a PCB by reflow ... 詳細を見る
This is a conceptual model illustrating how to couple fluid-structure interaction, heat transfer, and thermal expansion. A bimetallic strip in an air channel is heated so that it bends. After some time, an airflow with an inlet temperature which varies in time is introduced. As a ... 詳細を見る
In this example, the deformation of a rubber boot seal connected to a rigid pipe is studied. As the pipe rotates and the seal deforms, the flanges of the seal self-intersect and it also come into contact with the pipe. 詳細を見る
This tutorial introduces the use of topology optimization in acoustics. The goal of the optimization is to find the optimal material distribution (solid or air) in a given design domain, here the ceiling of a 2D room, that minimizes the average sound pressure level in an objective ... 詳細を見る
