アプリケーションギャラリには電気, 構造, 音響, 流体, 熱および化学分野に関連する COMSOL Multiphysics® チュートリアルおよびデモアプリファイルが用意されています. これらの例はチュートリアルモデルまたはデモアプリファイルとそれに付随する手順をダウンロードすることにより独自のシミュレーション作業の開始点として使用できます.
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In this example, which serves as a tutorial for contact analyses, the insertion of a snap hook in its groove is studied. A linear elastic material model is used. 詳細を見る
This example shows how to perform a fatigue analysis of a structure subjected to harmonic vibrations. The loading is applied at the attachments of the structure, and a frequency sweep is performed to compute the fatigue usage. 詳細を見る
This example shows how to set up self-contact for a coil spring. As the spring is compressed by a vertical force applied to one of its ends, it comes into to contact with itself and starts to rotate. 詳細を見る
In this tutorial the acoustic behavior of a duct or waveguide with a right angled bend is analyzed. The model uses port boundary conditions at the inlet and outlet. The ports can capture and treat non-plane propagating modes in waveguides, extending the analysis above the first cutoff ... 詳細を見る
This example presents a homogenized model of a corrugated sheet based on a unit cell approach. The numerically obtained equivalent stiffness matrices are compared with various analytical models. Two corrugation profiles, trapezoidal and round, are considered in this example. 詳細を見る
In his example, the lowest natural frequency of a 3D bracket are maximized using shape optimization. 詳細を見る
How well you can strike a golf ball is not only determined by your muscle strength, but more importantly it is influenced by the mechanics of golf swing. The outcome of golf stroke is basically determined by the movement of the club head just prior to the impact with the ball. In this ... 詳細を見る
In this example, a tensile test is simulated at four different strain rates. The Johnson–Cook hardening law is used to model the strain rate dependency of the plastic hardening. The temperature distribution and thermal expansion caused by the heating generated by the plastic ... 詳細を見る
Prior to the reliability testing, surface-mount devices (SMDs) are required to go through a preconditioning process, which represents the effects of storage and the typical reflow operation in the following board assembly process. During the preconditioning process, test samples usually ... 詳細を見る
This is a benchmark model for a plane stress problem. The accuracy of the computed stress concentration is evaluated, and a mesh convergence study is performed for different element types. 詳細を見る