アプリケーションギャラリには電気, 構造, 音響, 流体, 熱および化学分野に関連する COMSOL Multiphysics® チュートリアルおよびデモアプリファイルが用意されています. これらの例はチュートリアルモデルまたはデモアプリファイルとそれに付随する手順をダウンロードすることにより独自のシミュレーション作業の開始点として使用できます.
クイック検索機能を使用して専門分野に関連するチュートリアルやアプリを検索します. MPHファイルをダウンロードするには, ログインするか, 有効な COMSOL ライセンスに関連付けられている COMSOL アクセスアカウントを作成します. ここで取り上げた例の多くは COMSOL Multiphysics® ソフトウェアに組み込まれ ファイルメニューから利用できるアプリケーションライブラリからもアクセスできることに注意してください.
Reflow soldering is an important process in IC packaging. In reflow soldering, the solder materials are melted to create joints between electrical components and the PCBs for structural and electrical connections. This model demonstrates the process of attaching chips to a PCB by reflow ... 詳細を見る
This model demonstrates how to use the Magnetic Fields, Currents Only interface together with the Stationary Source Sweep with Initialization study to compute the inductance matrix of PCB coils with a number of 12. 詳細を見る
These models demonstrate the usage of the user defined lumped port and lumped elements to introduce excitations and lumped circuit elements between volumetric conductors. Additional models show how to use impedance and transition boundary conditions to model the conductors, instead of ... 詳細を見る
This model computes the lightning-induced voltage on an overhead line positioned above a lossy ground. It includes parameters like the inclination angle of lightning channels and soil conductivity, enabling straightforward analysis of their impacts. The calculated induced voltage aligns ... 詳細を見る
This tutorial explores how pulse reverse plating can be used as an additive-free alternative to attenuate small protrusions during copper metal deposition. By matching the process parameters, including the length of the forward and reverse pulses (duty cycles), a bright mirror-like metal ... 詳細を見る
This model demonstrates the "butterfly" filling mechanism for copper electrodeposition in a Through-Hole (TH) via exposed to an electrolyte containing halide-suppressor additives. The Tertiary Current Distribution, Nernst Planck interface in combination with Deformed Geometry is used ... 詳細を見る
This tutorial model explains how to extract lumped matrices by means of the Stationary Source Sweep study. The capacitance matrix of a five-terminal system is used to infer the position of a metallic object rather like real-world capacitive position sensors. The example illustrates the ... 詳細を見る
Microlithography lenses are used to project the image of an integrated circuit onto a silicon substrate. This tutorial demonstrates how to create a 21-element fused silica lens which has a NA of 0.56 which is designed to be used at a wavelength of 248nm. The lens, which has a total ... 詳細を見る
This model shows how to simulate a capacitively actuated surface micromachined accelerometer, using the Electromechanics Interface. It is based on a case study from the book Microsystem Design by Stephen D. Senturia (Kluwer Academic Publishers, 5th Edition, 2003, pages 513-525). 詳細を見る
Silicon micromechanical resonators have long been used for designing sensors and are now becoming increasingly important as oscillators in the consumer electronics market. In this series of models, a surface micromachined MEMS resonator, designed as part of a micromechanical filter, is ... 詳細を見る