アプリケーションギャラリには電気, 構造, 音響, 流体, 熱および化学分野に関連する COMSOL Multiphysics® チュートリアルおよびデモアプリファイルが用意されています. これらの例はチュートリアルモデルまたはデモアプリファイルとそれに付随する手順をダウンロードすることにより独自のシミュレーション作業の開始点として使用できます.
クイック検索機能を使用して専門分野に関連するチュートリアルやアプリを検索します. MPHファイルをダウンロードするには, ログインするか, 有効な COMSOL ライセンスに関連付けられている COMSOL Access アカウントを作成します. ここで取り上げた例の多くは COMSOL Multiphysics® ソフトウェアに組み込まれ ファイルメニューから利用できるアプリケーションライブラリからもアクセスできることに注意してください.
Reflow soldering is an important process in IC packaging. In reflow soldering, the solder materials are melted to create joints between electrical components and the PCBs for structural and electrical connections. This model demonstrates the process of attaching chips to a PCB by reflow ... 詳細を見る
The "Smart Radiator Device," a multilayer structure, has the capability to control thermal emissivity at different temperatures. This multilayer structure is lightweight thus finds its application in spacecraft mission. The thermochromic vanadium oxide (VO2) material is the heart of ... 詳細を見る
This tutorial shows how to simulate coupled heat and moisture transport in a wall made of a load bearing and an insulation layer. Moisture and temperature conditions vary with time on both sides of the wall and rain loading is included. The 1D model is a benchmark test defined in ... 詳細を見る
The Highly Accelerated Stress Test (HAST) is a testing technique to precipitate failure of electronic devices under elevated temperature and high humidity environment. This model demonstrates the structural analysis of a plastic encapsulated IGBT module under the HAST testing condition. ... 詳細を見る
This example shows how to model induction hardening of a small steel pin. The ferritic-pearlitic pin is induction heated using a coil with a high frequency alternating current. The surface of the pin is thereby austenitized, and the pin is then water cooled to produce a hard, martensitic ... 詳細を見る
This example solves for the temperature distribution inside a vacuum flask holding hot coffee. The main purpose is to illustrate how to use MATLAB functions to define material properties and boundary conditions. 詳細を見る
This tutorial model uses a heat sink geometry from the Part Library. The tutorial shows different approaches to heat transfer modeling when studying the cooling of an electronic chip. In the first part, only the solid parts are modeled, while the convective airflow is modeled using ... 詳細を見る
In this example you will build and solve a 3D beam model using the 3D Beam interface. This model shows how a thermally induced deformation of a beam is modeled. Temperature differences are applied across the top and bottom surfaces as well as the left and right surfaces of the beam. ... 詳細を見る
This model illustrates the greenhouse effect in a box covered by a plate and exposed to sun radiation over a day. The temperature variation is monitored in two cases: with a plate made of glass, transparent in the solar spectral band and opaque for the ambient solar band with a fully ... 詳細を見る
