アプリケーションギャラリには電気, 構造, 音響, 流体, 熱および化学分野に関連する COMSOL Multiphysics® チュートリアルおよびデモアプリファイルが用意されています. これらの例はチュートリアルモデルまたはデモアプリファイルとそれに付随する手順をダウンロードすることにより独自のシミュレーション作業の開始点として使用できます.
クイック検索機能を使用して専門分野に関連するチュートリアルやアプリを検索します. MPHファイルをダウンロードするには, ログインするか, 有効な COMSOL ライセンスに関連付けられている COMSOL Access アカウントを作成します. ここで取り上げた例の多くは COMSOL Multiphysics® ソフトウェアに組み込まれ ファイルメニューから利用できるアプリケーションライブラリからもアクセスできることに注意してください.
Lamb wave resonators are useful components for many radio-frequency applications. This tutorial shows how you model an aluminum nitride Lamb wave resonator and perform eigenfrequency and frequency-response analyses to characterize the device. 詳細を見る
This model analyzes the operation of a micromirror in air and the effects of thermoviscous damping on the vibration response. The model includes thermal losses in the structure as well as thermoviscous acoustic phenomena. The model couples the Thermoelasticity multiphysics interface to ... 詳細を見る
In this model, a full transient analysis of a loudspeaker driver is performed, which allow the modeling of nonlinear effects. It extends the linear frequency domain analysis done in the Loudspeaker Driver tutorial model. The analysis accounts for nonlinear behavior of the soft iron in ... 詳細を見る
A capacitive micromachined ultrasonic transducer (CMUT) is a micro-scale receiver that converts ultrasound to electrical signal for high-resolution imaging application. This CMUT design has optimized force-displacement characteristics for increased transduction efficiency. Central to the ... 詳細を見る
This example investigates the electrical performance of a cascaded cavity filter operating in the millimeter-wave 5G band with temperature changes. The thermal variations result in structural deformations of the structure. Thus, the resonant frequencies of the filter elements (cavities) ... 詳細を見る
This models pressure-dependent heating of 4 inch wafer on unipolar electrostatic chuck. Wafer sits on top of ring with electrostatic force holdong down wafer to counter upward pressure from gas flowing in gap between wafer and chuck surface. It is a problem involving 4 coupled physics ... 詳細を見る
As integrated circuit (IC) technology advances, with circuits becoming more powerful and compact, it is increasingly important to identify and prevent any cause of circuit failure. One particularly critical factor contributing to circuit failure is electromigration within the ... 詳細を見る
In this example, a tensile test is simulated at four different strain rates. The Johnson–Cook hardening law is used to model the strain rate dependency of the plastic hardening. The temperature distribution and thermal expansion caused by the heating generated by the plastic ... 詳細を見る
Die forming is a widespread sheet metal forming manufacturing process. The workpiece, usually a metal sheet, is permanently reshaped around a die through plastic deformation by forming and drawing processes. Simulations can be carried out in order to avoid cracks, tears, wrinkles, too ... 詳細を見る
Hydrodynamic bearings generate heat due to the viscous losses in the lubricant. As a result, the temperature of the rotor increases causing deformation and thermal stresses in both the rotor and the bearing housing. This example shows how to model different physical phenomena that are ... 詳細を見る
