アプリケーションギャラリには電気, 構造, 音響, 流体, 熱および化学分野に関連する COMSOL Multiphysics® チュートリアルおよびデモアプリファイルが用意されています. これらの例はチュートリアルモデルまたはデモアプリファイルとそれに付随する手順をダウンロードすることにより独自のシミュレーション作業の開始点として使用できます.
クイック検索機能を使用して専門分野に関連するチュートリアルやアプリを検索します. MPHファイルをダウンロードするには, ログインするか, 有効な COMSOL ライセンスに関連付けられている COMSOL Access アカウントを作成します. ここで取り上げた例の多くは COMSOL Multiphysics® ソフトウェアに組み込まれ ファイルメニューから利用できるアプリケーションライブラリからもアクセスできることに注意してください.
This model analyzes the nonlinear transfer impedance of a tapered orifice that can be part of a perforate or microperforated plate (MPP). The analysis is carried out for various degrees of tapering of the perforate and for a frequency range. A linear analysis is set up in the frequency ... 詳細を見る
This tutorial model demonstrates how to compute the impedance of a capacitively coupled plasma. The Time Periodic study computes the time periodic solution of the plasma. Subsequently, the solution is transformed to the time domain, after which the fast Fourier transform (FFT) solver is ... 詳細を見る
The COMSOL® software includes capabilities for 3D plasma modeling. In this example, a square coil is placed on top of a dielectric window and is electrically excited at 13.56 MHz. A plasma is formed in the chamber beneath the dielectric window, which contains argon gas at low ... 詳細を見る
A stationary 3D model of a generic fuel cell cathode describing the mass fraction distribution of oxygen, water, and nitrogen, as well as the current distribution. The model uses Darcy's Law to describe convection, and couples this to Maxwell-Stefan diffusivities to also describe mass ... 詳細を見る
Schottky Contact This benchmark simulates the behavior of an ideal Schottky barrier diode made of a tungsten contact deposited on a silicon wafer. The resulting J-V (current density vs. applied voltage) curve obtained from the model under forward bias is compared with experimental ... 詳細を見る
Electroless deposition or plating is a non-galvanic plating method that does not require any external electrical power. This technique is typically used for electroless plating of nickel, silver, gold and copper. In electroless deposition, partial oxidation and reduction reactions ... 詳細を見る
This model demonstrates the "butterfly" filling mechanism for copper electrodeposition in a Through-Hole (TH) via exposed to an electrolyte containing halide-suppressor additives. The Tertiary Current Distribution, Nernst Planck interface in combination with Deformed Geometry is used ... 詳細を見る
This model demonstrates the use of moving meshes in the application of copper electrodeposition on circuit boards. In these environments, the presence of cavities or 'trenches' are apparent. The model makes use of the Tertiary, Nernst-Planck interface for electrodeposition to keep track ... 詳細を見る
This model computes the ion energy distribution function (IEDF) for a commercial capacitively coupled plasma reactor. The results show good agreement with experimental data. 詳細を見る
This benchmark model simulates a GaAs nanowire using the self-consistent Schrödinger-Poisson theory to compute the electron density and the confining potential profiles. The predefined Schrödinger-Poisson multiphysics coupling feature is combined with the dedicated Schrödinger-Poisson ... 詳細を見る