アプリケーションギャラリ

This model demonstrates how to couple the Semiconductor interface to the Heat Transfer in Solids interface. A thermal analysis is performed on the existing bipolar transistor model in the case when the device is operated in the active-forward configuration. The Semiconductor interface ... 詳細を見る

As oil flows through a pipeline section heat is released due to the work of internal friction forces in the fluid. With good insulation of the pipeline, this generated heat can be used to avoid preheating of the oil, despite the fact that it is to be transported in a cold environment ... 詳細を見る

This tutorial shows how to use the Surface-to-Surface Radiation interface to simulate radiative heat transfer with radiation between diffuse emitters and diffuse-and-specular reflectors. This model is separated in two parts. The first part focuses on a validation test for the radiative ... 詳細を見る

In nuclear fusion reactors, the conducting fluid, such as the fusion plasma and the liquid metal in the reactor blanket, will interact with the background magnetic field. This phenomenon is referred to as magnetohydrodynamics (MHD). The electromagnetic field and fluid flow are fully ... 詳細を見る

This model simulates a static analysis of heat conduction in a thin conductive shell. This is a benchmark model where the result is compared with a NAFEMS benchmark solution. 詳細を見る

This model uses the discrete-ordinates method (DOM) to analyze the radiative heat transfer in a utility boiler with internal obstacles. DOM is one of the most useful radiation models for prediction of radiative heat fluxes on the furnace walls of a combustion chamber. With this model, ... 詳細を見る

This example describes the cooling and solidification, from melt to solid metal, in a continuous casting process. The model includes nonisothermal properties, temperature distribution, flow field, and phase change. This example uses the arbritrary Lagrangian-Eulerian method for modeling ... 詳細を見る

The suite of models examine the air cooling of circuit boards populated with multiple integrated circuits (ICs), which act as heat sources. Two possible cooling scenarios are depicted: vertically aligned boards using natural convection, and horizontal boards with forced convection (fan ... 詳細を見る

This example is a model of a continuous casting process. Liquid metal is poured into a mold of uniform cross section. The outside of the mold is cooled and the metal solidifies as it flows through. When the metal leaves the mold, it is completely solidified on the outside, but still ... 詳細を見る

This example is a variant of the Composite Thermal Barrier tutorial and shows how to set up multiple sandwiched thin layers with different thermal conductivities in two different ways. First, the composite is modeled as a 3D object. In the second approach the Lumped Thermal System ... 詳細を見る