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While transient analyses are useful for time domain reflectometry (TDR) to handle signal integrity (SI) problems, many RF and microwave examples are addressed using frequency domain simulations generating S-parameters. However, from the frequency domain data it is difficult to identify ... 詳細を見る

The drive for miniaturizing electronic devices has resulted in today’s extensive use of surface-mount electronic components. An important aspect in electronics design and the choice of materials is a product’s durability and lifetime. For surface-mount resistors and other components ... 詳細を見る

In this model a Knowles ED23146 receiver (miniature loudspeaker) is connected to a test set-up consisting of a 50 mm (1 mm diameter) earmold tube and a so-called 0.4-cc coupler. The receiver is modeled using a lumped spice network and connected to the finite element domain at the tube ... 詳細を見る

This is a model of a moving-coil loudspeaker where a lumped parameter analogy represents the behavior of the electrical and mechanical speaker components. The Thiele-Small parameters (small-signal parameters) serve as input to the lumped model, which is represented by an Electric Circuit ... 詳細を見る

A Touchstone file describes the frequency responses of an n-port network circuit in terms of S-parameters. This can be used to simplify arbitrarily complex circuits. The Touchstone file can be obtained from numerical simulations or network analyzer measurements. The obtained file for a ... 詳細を見る

All integrated circuits (ICs) — especially high-speed devices — produce heat. In today’s dense electronic system layouts, heat sources are many times placed close to heat-sensitive ICs. Designers of printed circuit boards often need to consider the relative placement of heat ... 詳細を見る

Example of a moving-coil loudspeaker where lumped parameters represent the behavior of the electrical and mechanical components. The Thiele-Small parameters (small-signal parameters) serve as input to the lumped model, which is represented using the Electric Circuit interface. The ... 詳細を見る

This model analyzes the thermal expansion in a MEMS device, such as a microgyroscope, where thermal expansion should be minimized. The device is made from the copper-beryllium alloy UNS C17500 and uses temperature-dependent material properties from the Material Library. The purpose of ... 詳細を見る

これは, マルチターンの一次コイルと二次コイルに均質化アプローチを使用した単相 E コア変圧器の過渡モデルです. このモデルには, コアの磁気飽和 (B-H 曲線) の影響が含まれており, 電気回路インターフェースを使用して変圧器モデルを外部回路に接続する方法を示しています. シミュレーションは, 1つの巻数比の場合と 1000 の巻数比の場合の2つの異なるケースで実行されます. 詳細を見る

COMSOL Multiphysics provides an interactive meshing environment where, with a few mouse clicks, you can easily mesh individual faces or domains. Each meshing operation is added to the meshing sequence. The final mesh is the result of building all the operations in the meshing sequence. ... 詳細を見る