アプリケーションギャラリには電気, 構造, 音響, 流体, 熱および化学分野に関連する COMSOL Multiphysics® チュートリアルおよびデモアプリファイルが用意されています. これらの例はチュートリアルモデルまたはデモアプリファイルとそれに付随する手順をダウンロードすることにより独自のシミュレーション作業の開始点として使用できます.
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This model demonstrates the use of moving meshes in the application of copper electrodeposition on circuit boards. In these environments, the presence of cavities or 'trenches' are apparent. The model makes use of the Tertiary, Nernst-Planck interface for electrodeposition to keep track ... 詳細を見る
Steel pipelines are often subjected to complex stress/strain conditions in the oil and gas industry. Additionally, pipes are subjected to significant longitudinal strain due to soil movement. For the elastoplastic stress simulation, the Solid Mechanics interface is used with the small ... 詳細を見る
An electron gun must be able to draw a sufficient current and accelerate the electrons to the desired speed. The first part of an electron gun geometry presents unique design challenges because the emitted electron speeds are usually lowest there, and therefore the space charge density ... 詳細を見る
In this example, three parallel pipelines of length 68 km and a horizontal separation distance of 10 m between them are protected against corrosion by an impressed current cathodic protection (ICCP) system using a series of anodes. Each anode is connected to all three pipelines, ... 詳細を見る
DC glow discharges in the low-pressure regime have long been used for gas lasers and fluorescent lamps. DC discharges are attractive to study because the solution is time independent. The 1D and 2D models show how to use the DC Discharge interface to set up an analysis of a positive ... 詳細を見る
Magnesium alloys are attractive alternatives as lightweight materials in various fields of engineering. Magnesium is however relatively non-noble and may suffer considerable galvanic corrosion when being used in conjunction with other metals, for instance when mounting an Mg alloy ... 詳細を見る
As integrated circuit (IC) technology advances, with circuits becoming more powerful and compact, it is increasingly important to identify and prevent any cause of circuit failure. One particularly critical factor contributing to circuit failure is electromigration within the ... 詳細を見る
This example models time-dependent copper deposition on a resistive wafer in a cupplater reactor. As the deposited layer builds up, the resistive losses of the deposited layer decreases. The benefit of using a current thief for a more uniform deposit is demonstrated. 詳細を見る
This model demonstrates the "butterfly" filling mechanism for copper electrodeposition in a Through-Hole (TH) via exposed to an electrolyte containing halide-suppressor additives. The Tertiary Current Distribution, Nernst Planck interface in combination with Deformed Geometry is used ... 詳細を見る
Corrosion induced due to alternating current (AC) is evident in the oil and gas industry, particularly when a pipeline is in close proximity to the high power transmission lines. A numerical model presented here first evaluates the effect of direct current (DC) applied potential on ... 詳細を見る