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Electroless deposition or plating is a non-galvanic plating method that does not require any external electrical power. This technique is typically used for electroless plating of nickel, silver, gold and copper. In electroless deposition, partial oxidation and reduction reactions ... 詳細を見る

This tutorial explores how pulse reverse plating can be used as an additive-free alternative to attenuate small protrusions during copper metal deposition. By matching the process parameters, including the length of the forward and reverse pulses (duty cycles), a bright mirror-like metal ... 詳細を見る

This example models electrocoating of paint onto a car door in a time-dependent simulation. The deposited paint is highly resistive which results in lowered local deposition rates for coated areas. A primary current distribution in combination with a film resistance model is used to ... 詳細を見る

Electrochromic devices (ECDs) may be employed in ”smart” windows, for instance in buildings or motor cycle visors, where the transparency of the device can be controlled by applying a voltage. ECDs make use of the fact that the absorbance of visual light for a chemical species in a ... 詳細を見る

This asset contains the model file described in the blog post titled "Approaching an Electrochemical Model from Scratch: Lemon Battery". 詳細を見る

When several components are to be electroplated they are typically mounted on a rack in the electroplating bath. An important aspect is then achieving a uniform thickness of the plated layer for all components mounted on the rack. This example model allows for investigating the effect ... 詳細を見る

This example shows how to model secondary current distribution and electrode growth with a moving geometry. To avoid numerical instabilities, a seed layer is introduced in the initial geometry to obtain a right angle at the edge between the growing electrode and the insulator. 詳細を見る

This example simulates electroplating of a printed circuit board (PCB) in 3D using the Secondary Current Distribution interface. In order to achieve thickness uniformity across the PCB, a dummy pattern is included in the design, along with an aperture in the electroplating bath. 詳細を見る

The purpose of this model is to visualize the electric potential in an electrochemical cell, for example a battery. This is done at OCV and during operation. In a battery, this would correspond to OCV, discharge, and recharge. The potential profile is explained both for cells with planar ... 詳細を見る

This is a model of the secondary current distribution in a zinc electrowinning cell. The model investigates the impact on the current distribution when changing the electrode alignment in a parametric study. The geometry is in 2D. 詳細を見る