アプリケーションギャラリには電気, 構造, 音響, 流体, 熱および化学分野に関連する COMSOL Multiphysics® チュートリアルおよびデモアプリファイルが用意されています. これらの例はチュートリアルモデルまたはデモアプリファイルとそれに付随する手順をダウンロードすることにより独自のシミュレーション作業の開始点として使用できます.
クイック検索機能を使用して専門分野に関連するチュートリアルやアプリを検索します. MPHファイルをダウンロードするには, ログインするか, 有効な COMSOL ライセンスに関連付けられている COMSOL アクセスアカウントを作成します. ここで取り上げた例の多くは COMSOL Multiphysics® ソフトウェアに組み込まれ ファイルメニューから利用できるアプリケーションライブラリからもアクセスできることに注意してください.
The first model describes the simultaneous flow of two immiscible fluids in porous media - here air displaces water in a multi-step inlet pressure experiment. We solve for the pressure and the degree saturation for the air and water within a representative volume and so track saturation ... 詳細を見る
Including circumferential displacements in a 2D axisymmetric Solid Mechanics interface allows to compute twist and bending deformations. This model determines stress concentration factors for a hollow shaft for load cases of axial extension, torsion, as well as bending, using a ... 詳細を見る
Induced eddy currents and associated thermal loads is of interest in many high power AC applications. This example is of general nature and illustrates some of the involved physics as well as suitable modeling techniques in the AC/DC Module. In this model a metallic plate is placed ... 詳細を見る
For slender structures, buckling is a catastrophic instability if the service load is above the critical limit. For such structures, it can be important to study the behavior of the structure beyond the critical buckling load, which is known as postbuckling analysis. Tracing the ... 詳細を見る
Ion implantation is used extensively in the semiconductor industry to implant dopants into wafers. Within an ion implanter, ions generated within an ion source are accelerated by an electric field to achieve the desired implant energy. Ions of the correct charge state are selected by ... 詳細を見る
This problem follows a typical preliminary board-level thermal analysis. First perform a simulation of the board with some Integrated Circuits (ICs). Then, add a disk-stack heat sink to observe cooling effects. Finally, explore adding a copper layer to the bottom of the board in order to ... 詳細を見る
All integrated circuits (ICs) — especially high-speed devices — produce heat. In today’s dense electronic system layouts, heat sources are many times placed close to heat-sensitive ICs. Designers of printed circuit boards often need to consider the relative placement of heat ... 詳細を見る
This app demonstrates the following: Multiple components (1D and 3D) in a single app Using the same choice list in the app as in the model using Data Access functionality Output numerical results for a specific time step using a combo box The app combines the Ray Optics Module and ... 詳細を見る
This tutorial demonstrates how to model the interaction between an acoustic field and the heat release from a flame, using the Flame Model domain feature. Modeling this interaction is important in order to understand and predict unstable acoustic modes in gas turbines and jet engines. ... 詳細を見る
This model analyzes the nonlinear transfer impedance of a tapered orifice that can be part of a perforate or microperforated plate (MPP). The analysis is carried out for various degrees of tapering of the perforate and for a frequency range. A linear analysis is set up in the frequency ... 詳細を見る