アプリケーションギャラリには電気, 構造, 音響, 流体, 熱および化学分野に関連する COMSOL Multiphysics® チュートリアルおよびデモアプリファイルが用意されています. これらの例はチュートリアルモデルまたはデモアプリファイルとそれに付随する手順をダウンロードすることにより独自のシミュレーション作業の開始点として使用できます.
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This model shows how to combine different types of material nonlinearity, such as creep and elastoplasticity. In this specific example you will perform a stress and nonlinear strain analysis on a thick cylinder under a nonproportional loading: an initial temperature increase followed by ... 詳細を見る
This model couples the Navier Stokes equations and the heat transfer equations to examine density driven flow of free fluids. Here the fluid is in a square cavity with a heated wall. The buoyancy force is a Boussinesq term added to the Navier-Stokes equations. The equation is ... 詳細を見る
The drive for miniaturizing electronic devices has resulted in today’s extensive use of surface-mount electronic components. An important aspect in electronics design and the choice of materials is a product’s durability and lifetime. For surface-mount resistors and other components ... 詳細を見る
This example studies the stationary state of free convection in a cavity filled with water and bounded by two vertical plates. To generate the buoyancy flow, the plates are heated at different temperatures, bringing the regime close to the transition between laminar and turbulent. To ... 詳細を見る
Thermoelastic damping, which arises when you subject a material to cyclic stress, is an important factor when designing MEMS resonators. The stress brings about deformation, where materials heat under compressive stress and cool under tensile stress. Thus, due to the resulting heat flux, ... 詳細を見る
This example studies viscoplastic creep in solder joints under thermal loading using the Anand viscoplasticity model, which is suitable for large, isotropic, viscoplastic deformations in combination with small elastic deformations. The geometry includes two electronic components (chips) ... 詳細を見る
静電容量式圧力センサーのシミュレーションを行います. このモデルは, 圧力センサーの印加圧力に対する応答をシミュレーションする方法と, パッキングによる応力がセンサーの性能に与える影響を解析する方法を示します. 詳細を見る
This example demonstrates how to model phase transition by a moving boundary interface according to the Stefan problem. A square cavity containing both solid and liquid tin is submitted to a temperature difference between left and right boundaries. Fluid and solid parts are solved in ... 詳細を見る
In massive forming processes like rolling or extrusion, metal alloys are deformed in a hot solid state with material flowing under ideally plastic conditions. Such processes can be simulated effectively using computational fluid dynamics, where the material is considered as a fluid with ... 詳細を見る
This model analyzes the operation of a micromirror in air and the effects of thermoviscous damping on the vibration response. The model includes thermal losses in the structure as well as thermoviscous acoustic phenomena. The model couples the Thermoelasticity multiphysics interface to ... 詳細を見る