アプリケーションギャラリには電気, 構造, 音響, 流体, 熱および化学分野に関連する COMSOL Multiphysics® チュートリアルおよびデモアプリファイルが用意されています. これらの例はチュートリアルモデルまたはデモアプリファイルとそれに付随する手順をダウンロードすることにより独自のシミュレーション作業の開始点として使用できます.
クイック検索機能を使用して専門分野に関連するチュートリアルやアプリを検索します. MPHファイルをダウンロードするには, ログインするか, 有効な COMSOL ライセンスに関連付けられている COMSOL アクセスアカウントを作成します. ここで取り上げた例の多くは COMSOL Multiphysics® ソフトウェアに組み込まれ ファイルメニューから利用できるアプリケーションライブラリからもアクセスできることに注意してください.
The model simulates atmospheric corrosion of a galvanic couple, comprising of an Al-Co-Ce metallic coating and an aluminum alloy, which is in contact with electrolyte film of 100 micrometer thickness. The corrosion inhibitors are released from the metallic coating and are transported ... 詳細を見る
An Electromagnetic Band Gap (EBG) structure can be used to increase the isolation between antennas close to each other. The decoupling effect is not only a function of frequency but also polarization and coupling-plane configuration. When designing an EBG structure, one needs to make ... 詳細を見る
The metal-silicon-oxide (MOS) structure is the fundamental building block for many silicon planar devices. Its capacitance measurements provide a wealth of insight into the working principles of such devices. This tutorial constructs a simple 1D model of a MOS capacitor (MOSCAP). Both ... 詳細を見る
Passive devices can be designed using lumped element features if both the operating frequency of the device and the insertion loss of lumped elements are low. This example simulates two types of lumped element filters that are similar to lumped ports, except that they are strictly ... 詳細を見る
This model shows how to set up a simple Bipolar Transistor model. The output current-voltage characteristics in the common-emitter configuration are computed and the common-emitter current gain is determined. 詳細を見る
A surface mount resistor is subjected to thermal cycling. The difference in the thermal expansion of different materials will introduce stresses in the structure. The solder which connects the resistor with the printed circuit board is seen as the weakest link in the assembly. It ... 詳細を見る
This tutorial model solves the Gross–Pitaevskii Equation for the vortex lattice formation in a rotating Bose–Einstein condensate bound by a harmonic trap. The equation is essentially a nonlinear single-particle Schrödinger Equation, with the inter-particle interaction represented by a ... 詳細を見る
In this conceptual example, the soft impact between two elastic rings is modeled using the Solid Mechanics interface. One of the rings is given an initial velocity to initiate the impact event. Both rings are unconstrained and not subjected to any external forces. Contact is modeled ... 詳細を見る
Use this app to validate that the default settings correctly submit jobs to a cluster. These default settings are taken from the preferences. The app allows you to override the default cluster settings, test modifications to the current setup, and test different settings for connecting ... 詳細を見る
This tutorial model uses a heat sink geometry from the Part Library. The tutorial shows different approaches to heat transfer modeling when studying the cooling of an electronic chip. In the first part, only the solid parts are modeled, while the convective airflow is modeled using ... 詳細を見る