アプリケーションギャラリには電気, 構造, 音響, 流体, 熱および化学分野に関連する COMSOL Multiphysics® チュートリアルおよびデモアプリファイルが用意されています. これらの例はチュートリアルモデルまたはデモアプリファイルとそれに付随する手順をダウンロードすることにより独自のシミュレーション作業の開始点として使用できます.
クイック検索機能を使用して専門分野に関連するチュートリアルやアプリを検索します. MPHファイルをダウンロードするには, ログインするか, 有効な COMSOL ライセンスに関連付けられている COMSOL アクセスアカウントを作成します. ここで取り上げた例の多くは COMSOL Multiphysics® ソフトウェアに組み込まれ ファイルメニューから利用できるアプリケーションライブラリからもアクセスできることに注意してください.
This tutorial drives a capacitively coupled plasma with an L-type matching network at high and low powers. At low power, where the harmonics in the current are low, prefect matching is obtained at the chosen power value. Sweeps over power, frequency, and pressure are performed and their ... 詳細を見る
A surface mount resistor is subjected to thermal cycling. The difference in the thermal expansion of different materials will introduce stresses in the structure. The solder which connects the resistor with the printed circuit board is seen as the weakest link in the assembly. It ... 詳細を見る
An aperture is often used in electroplating baths in order to improve the uniformity of the deposited metal layer. This example simulates electroplating of a printed circuit board (PCB) in 3D using a secondary current distribution. The size and aspect ratio of the aperture is optimized ... 詳細を見る
If an inductor's magnetic material is nonlinear, then the inductance depends on the current passing through it. This model consists of an inductor with a nonlinear magnetic core, where the small-signal inductance is simulated as a function of current. The model also investigates how ... 詳細を見る
DC glow discharges in the low-pressure regime have long been used for gas lasers and fluorescent lamps. DC discharges are attractive to study because the solution is time independent. The 1D and 2D models show how to use the DC Discharge interface to set up an analysis of a positive ... 詳細を見る
This example studies viscoplastic creep in solder joints under thermal loading using the Anand viscoplasticity model, which is suitable for large, isotropic, viscoplastic deformations in combination with small elastic deformations. The geometry includes two electronic components (chips) ... 詳細を見る
Electrical components in wireless communication systems are designed to be small and light for portability and productivity while maintaining decent performance and efficiency. Antennas are essential components in mobile devices and are required to fit in the limited space allowed by ... 詳細を見る
This example shows how to perform a fatigue analysis of a structure subjected to random vibrations. Times to failure using the cycle counting models according to Bendat and Dirlik are compared. 詳細を見る
This model demonstrates the use of moving meshes in the application of copper electrodeposition on circuit boards. In these environments, the presence of cavities or 'trenches' are apparent. The model makes use of the Tertiary, Nernst-Planck interface for electrodeposition to keep track ... 詳細を見る
The mutual inductance and induced currents between a single turn primary and twenty turn secondary coil in a concentric coplanar arrangement is computed using a frequency domain model. The secondary coil is modeled using a homogenized approach which does not explicitly consider each turn ... 詳細を見る