アプリケーションギャラリには電気, 構造, 音響, 流体, 熱および化学分野に関連する COMSOL Multiphysics® チュートリアルおよびデモアプリファイルが用意されています. これらの例はチュートリアルモデルまたはデモアプリファイルとそれに付随する手順をダウンロードすることにより独自のシミュレーション作業の開始点として使用できます.
クイック検索機能を使用して専門分野に関連するチュートリアルやアプリを検索します. MPHファイルをダウンロードするには, ログインするか, 有効な COMSOL ライセンスに関連付けられている COMSOL Access アカウントを作成します. ここで取り上げた例の多くは COMSOL Multiphysics® ソフトウェアに組み込まれ ファイルメニューから利用できるアプリケーションライブラリからもアクセスできることに注意してください.
FEM simulation can be used to obtain a SAW velocity and some related parameters (squared electromechanical coupling coefficient, reflectivity, etc.) for different typical configurations. Such parameters are input data for various analytical and semi-analytical methods of SAW device ... 詳細を見る
This example studies viscoplastic creep in solder joints under thermal loading using the Anand viscoplasticity model, which is suitable for large, isotropic, viscoplastic deformations in combination with small elastic deformations. The geometry includes two electronic components (chips) ... 詳細を見る
This model computes the input impedance/admittance to an acoustic system in the frequency domain. The system here represents a typical measurement setup used for testing hearing aids and includes domains with thermoviscous boundary layer losses. The input admittance, computed in the ... 詳細を見る
The model of 1D Dielectric Barrier Discharge (DBD) has been recomputed with the three different kinds of electron energy distribution functions (EEDFs): The Maxwellian function The Druyvesteyn function The computed EEDF based on the Boltzmann Equation, Two-Term Approximation ... 詳細を見る
This tutorial demonstrates how to build the geometry for the 3D biased resonator from GDS file using the ECAD Import Module and the Design Module. The procedure emulates semiconductor and MEMS fabrication processes to build 3D geometry more efficiently and is more intuitive for those ... 詳細を見る
This example models galvanic corrosion between two different phases in a magnesium alloy for a representative cross-sectional microstructure configuration. The Level Set interface is used here to model dissolution of a constituent phase leading to topological changes. The electrode ... 詳細を見る
The ball grid array (BGA) technology is a surface-mount technology widely used in electronic packaging. Usually, there are two types of solder balls considered in the array, including the functional balls that are required for electric connections and the support balls that are used only ... 詳細を見る
Solar concentrator/cavity receiver systems can be used to focus incident solar radiation into a small region, generating intense heat which can then be converted to electrical or chemical energy. A common figure of merit in solar thermal power systems is the concentration ratio, or the ... 詳細を見る
