アプリケーションギャラリ

In the semiconductor manufacturing process, photoresist coating is an important process and the thickness of the photoresist layer needs to be precisely controlled. Usually, the photoresist layer is thinned by spin coating. The specific principle is to use centrifugal force to throw ... 詳細を見る

Interfacial failure or delamination in a composite material can be simulated with a cohesive zone model (CZM). A key ingredient of a cohesive zone model is a traction-separation law that describes the softening in the cohesive zone near the delamination tip. This example shows the ... 詳細を見る

Thermoelectric elements are often used to cool or heat electronic components to a desired temperature. In such simulations, you are typically not interested in the behavior of the thermoelectric element itself but want to use its performance characteristics to model the overall response ... 詳細を見る

This app demonstrates the following: Geometry parts and parametric geometries Dark theme Use of subwindows Material appearance visualization with environment reflections Report generation for both Microsoft® Word and Microsoft® PowerPoint Options for setting different mesh sizes ... 詳細を見る

This tutorial uses a simple 1D model of a silicon solar cell to illustrate the basic steps to set up and perform a device physics simulation with the Semiconductor Module. A user-defined expression is used for the photo-generation rate and the result shows typical I–V and P–V curves of ... 詳細を見る

In this application, a solution is pumped through a catalytic bed where a solute species reacts as it gets in contact with the solid catalyst. The purpose of this example is to maximize the total reaction rate for a given total pressure difference across the bed, by finding the optimal ... 詳細を見る

Thermal management has become a critical aspect of today’s electronic systems, which often include many high-performance circuits that dissipate large amounts of heat. Many of these components require efficient cooling to prevent overheating. Some of these components, such as processors, ... 詳細を見る

This model simulates an LED that emits in the infrared part of the electromagnetic spectrum. The device structure is made up of a single p-n junction formed by a layer of p-type doping near the top surface of an otherwise n-type wafer. This kind of device geometry is simple and cheap to ... 詳細を見る

This example shows how to model a FinFET in 3D. The I-V characteristics of the device are simulated. First, the gate voltage is swept to obtain the drain current versus gate voltage plot. Then, the drain current versus drain voltage characteristics are computed for fixed gate voltages. 詳細を見る

An electrostatically actuated MEMS resonator is simulated. The device is driven by an AC + DC bias voltage applied across a parallel plate capacitor. In this example, the pull-in and pull-out voltages of the resonator are computed. This is done via a quasi-static analysis of the ... 詳細を見る