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The miniaturization of electronics devices requires batteries with higher energy density and power. To increase the contact area between the electrodes and the solid electrolyte, 3D configurations such as the trench geometry are used. This example demonstrates how to model a solid-state ... 詳細を見る
These models illustrate some important topics when modeling buckling imperfection. The Euler 2 Buckling Imperfection model shows a simple case with a cantilever beam buckling under compression. Three different buckling modes are combined as initial imperfections. The other model, ... 詳細を見る
In this multibody dynamics model of a simple counterweight trebuchet, a parametric sweep is used to study throwing distance as function of the sling length. For more details on performing a multibody analysis of a counterweight trebuchet, see this blog post: What Is the Physics Behind a ... 詳細を見る
The electrodes of a lithium-ion battery are porous, consisting of an active solid material, a binder, and pores filled with liquid electrolyte. If a force is applied on the porous layers of a battery, this will affect the volume fraction of the electrolyte-filled pores in the electrodes, ... 詳細を見る
A highly simplified pedestrian bridge is for simplicity imagined to consists of a concrete slab on supported by three I-beams. The design is to be evaluated for peak acceleration due to walking. The model analyzes uncertainty in peak acceleration due to some material damping properties ... 詳細を見る
This model uses the Granular Flow and Membrane interfaces to simulate the packing of spherical grains in a flexible container, a procedure often found in the processing industry. In this example, grains are packed into a cubic container constructed of a thin polymer fabric. Two packing ... 詳細を見る
This model describes the corrosion of magnesium (Mg) alloys in physiological environments using a phase-field formulation. The approach couples Mg dissolution kinetics with ionic transport, enabling the transition from activation-controlled to diffusion-controlled regimes to be captured. ... 詳細を見る
In semiconductor manufacturing, vacuum chucks are used to rapidly and contamination-free adsorb and secure wafers before processes such as transfer, lithography, and inspection. Traditional empirical design makes it difficult to quantify the effects of groove shape, size, distribution, ... 詳細を見る
PCB is fabricated by laminating multiple materials, such as FR-4, copper, and resin, which exhibit significantly different coefficients of thermal expansion (CTE). When subjected to heating, the differential thermal expansion among these layers induces interlaminar deformation mismatch, ... 詳細を見る
Beam theories are well-developed for slender structures with homogeneous materials and isotropic cross-sections. The traditional beam theories do no apply to beams made of different materials in the cross-section. Therefore, a homogenization-based numerical model is needed to compute ... 詳細を見る
