アプリケーションギャラリ

In this example, the homogenized elastic and viscoelastic properties of a particulate composite are computed based on the individual properties of elastic particles embedded in a viscoelastic matrix. Periodic boundary conditions are applied to a unit cell of the particulate composite ... 詳細を見る

This is a benchmark model for a plane stress problem. The accuracy of the computed stress concentration is evaluated, and a mesh convergence study is performed for different element types. 詳細を見る

膜, 板, 固体などの構造物と結合した液体または気体の音響は, 多くの工学分野において重要な応用分野です. このモデルは, 固体物体と結合した3次元の音響流体現象を一般的に実証するものです. 固体物体の壁は音圧の影響を受けます. 固体からの周波数応答が計算され, 音響領域にフィードバックされることで波形を解析できます. したがって, このモデルは散乱問題の好例となります. 詳細を見る

In this example, a torque is applied to the inner edge of a circular annulus-shaped membrane while the outer edge is fixed, resulting in membrane wrinkling. The wrinkling membrane model avoids the equilibrium instability that would be produced by the compressive stresses. The effect of ... 詳細を見る

This example shows how to model prestressed bolts. The bolt geometry is taken from the Part Libraries. For comparison, one of the bolts is modeled using a thread contact formulation, whereas the other bolt is connected to the bolt hole by a pure continuity condition. The reduced ... 詳細を見る

Sensitivity analysis is an efficient way of computing the gradient of an objective function with respect to many control variables. This example uses the pitch and yaw in the top of a truss tower as objective functions. It shows how to compute the sensitivity of these angles with respect ... 詳細を見る

Using a Fluid-Solid Interaction multiphysics interface, the behavior of a spring-loaded ball check valve is studied under varying functional and reverse flow. The fluid force acting on the ball opens the valve at the opening pressure. In the case of a reversed pressure, the ball comes ... 詳細を見る

In this shape optimization example, the mass of a bracket is minimized by changing the size and position of a number of geometrical objects. The requirements give limits both on the lowest natural frequency, and on the maximum stress in a static load case. This means that results from ... 詳細を見る

This is a conceptual model illustrating how to couple fluid-structure interaction, heat transfer, and thermal expansion. A bimetallic strip in an air channel is heated so that it bends. After some time, an airflow with an inlet temperature which varies in time is introduced. As a ... 詳細を見る

Reflow soldering is an important process in IC packaging. In reflow soldering, the solder materials are melted to create joints between electrical components and the PCBs for structural and electrical connections. This model demonstrates the process of attaching chips to a PCB by reflow ... 詳細を見る