アプリケーションギャラリには電気, 構造, 音響, 流体, 熱および化学分野に関連する COMSOL Multiphysics® チュートリアルおよびデモアプリファイルが用意されています. これらの例はチュートリアルモデルまたはデモアプリファイルとそれに付随する手順をダウンロードすることにより独自のシミュレーション作業の開始点として使用できます.
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This example illustrates how to perform eigenfrequency and static analyses of a ladder frame structure for a light truck. Important modeling strategies are described. For example, how to convert a solid geometry to a shell model, how to make different types of connections, and how to ... 詳細を見る
This is a benchmark model for a plane stress problem. The accuracy of the computed stress concentration is evaluated, and a mesh convergence study is performed for different element types. 詳細を見る
Many engineering structures consist of thin and slender components, where a full solid model will result in extremely many small elements. For such structures, it is much more efficient to use shell or beam elements. In this tutorial and verification model, it is shown how to connect ... 詳細を見る
A fuel cell stack operates at temperatures just below 100 °C, which means that it has to be heated at start-up. The fuel cell stack consists of unit cell of anode, membrane, and cathode connected in series through bipolar plates. This study presents a model that couples the thermal and ... 詳細を見る
An AC contactor is a particular type of magnetic switch device, which is activated by a primary coil fed by an alternating current. Unlike DC switches, such devices can suffer from a tendency to reopen when the AC current crosses zero. The addition of a shading coil that supports ... 詳細を見る
This example demonstrates how to model coupled flow, heat transfer, and structural deformation and stress in a pipeline network. Gravity loads from the pipe and fluid are also taken into account. 詳細を見る
In this tutorial example, the concepts of Component Mode Synthesis (CMS) are introduced through a simple solid model of a cantilever beam. Parts of the beam are reduced by the CMS technique. It is, furthermore, shown how CMS can be used to represent both the static and dynamic behavior ... 詳細を見る
Reflow soldering is an important process in IC packaging. In reflow soldering, the solder materials are melted to create joints between electrical components and the PCBs for structural and electrical connections. This model demonstrates the process of attaching chips to a PCB by reflow ... 詳細を見る
As integrated circuit (IC) technology advances, with circuits becoming more powerful and compact, it is increasingly important to identify and prevent any cause of circuit failure. One particularly critical factor contributing to circuit failure is electromigration within the ... 詳細を見る
The vibration modes of a thin or thick circular disc are well known, and it is possible to compute the corresponding eigenfrequencies to arbitrary precision from a series solution. The same is true for the acoustic modes of an air-filled cylinder with perfectly rigid walls. A more ... 詳細を見る