COMSOL Conference 2026 Proceedings
プログラム委員会に採択された論文, ポスター, スライドショー
COMSOL Conference 2026 では, 世界中のエンジニア, 研究者, 科学者が, 主要な産業分野および学術界におけるモデリングとシミュレーションの活用事例を紹介しました. クイック検索ツールを使用して特定の発表を検索したり, トピックやイベント開催地での絞り込みができます.
Integrating piezoelectric actuators onto photonic integrated circuits equips passive photonic components with active tunability and modulation capabilities [1]. Lead zirconate titanate (PZT) chips have been hybrid integrated onto microring resonators to demonstrate tunable external ... 詳細を見る
The dual-radiator Ring Imaging Cherenkov (dRICH) detector of the EPIC experiment requires a pressurized gas vessel that combines low mass, dimensional stability, and structural reliability. This work investigates a 1:10 scale vessel prototype manufactured from carbon-fiber-reinforced ... 詳細を見る
The traditional adjustable insulation test reactor has a problem where the leakage magnetic field of the core intersect with the coils within large areas, which leads to huge coil eddy loss. Based on the complex power density theory of homogenized multi-turn conductor, this study ... 詳細を見る
Foam, as the internal filling material for headphone ear cushion, has a significant influence on user experience (UX) as well as the acoustic performance (PNC & FR) of headphones. Selecting the appropriate foam in practical product development is therefore critical, and a thorough ... 詳細を見る
Silicon photonic devices feature a high degree of integration and strong optical field confinement. However, the temperature rise induced by local optical absorption can lead to variations in the material refractive index, thereby affecting the optical resonance characteristics and mode ... 詳細を見る
The risk of thermal runaway highlights the critical need for efficient liquid cooling in lithium-ion batteries. This study employs COMSOL Multiphysics® to perform topology optimization of cooling channels within a battery cold plate. Using the density method, we couple turbulent flow and ... 詳細を見る
Efficient operations of hot-electron photodetectors (HE PDs) require strong energy deposition in metals assisted by device-dependent optical resonances whose spectral properties are fundamental to electrical performances, particularly in terms of the linewidths of responsivity spectra. ... 詳細を見る
Direct wafer bonding is a key process for advanced 3D integration, in which the propagation of the bonding front strongly influences bonding efficiency and process stability [1]. Bonding wave velocity is governed by the coupled effects of wafer deformation, interfacial fluid transport, ... 詳細を見る
