研究開発におけるマルチフィジックスシミュレーションの具体例
マルチフィジックスモデリングとシミュレーションは, 産業界や学術界のさまざまな分野でイノベーションを推進しています. そのことは, 毎年 COMSOL Conference でエンジニア, 研究者, 科学者が発表する技術論文やポスターで紹介される数多くの活用事例からも明らかです. 以下にまとめられた最近の講演論文集から新たなアイデアやヒントを得たり, クイック検索ツールを使用して特定の発表を検索したり, アプリケーション分野, カンファレンスの開催年や開催地で絞り込んだりできます.
COMSOL Conference 2026 論文集を見る
The simplicity, reliability and low costs of electro-mechanical breakers have made them the workhorse for the interruption of low voltage short-circuit currents. In the presence of a short circuit, the contacts of the breaker heat up, and a bridge of molten metal forms between the pair ... 詳細を見る
The paper describes how the fluxgate current sensor works and how it is built in the COMSOL Multiphysics® software. Four COMSOL® modules were used: -AC/DC Module: the magnetic field physic is used in order to apply the Ampere-Maxwell’s law to the different sensor components and to the ... 詳細を見る
In this paper, the topic of frequency-controlled manipulation of sinking particles in a stationary liquid column based on AC dielectrophoresis is studied in depth. Particles sink downwards within a liquid column due to the gravitational force. In doing so, they are subjected to Stokes ... 詳細を見る
Induction heating (IH) [1] is an electrically driven process useful for decarbonization of the industry. It can be used for electrification of chemical processes to replace traditional heating with gas burner and avoid CO2 emission. This kind of process can be used to heat efficiently ... 詳細を見る
Modern electrical vehicle motors require a precise current control over the rotation of the rotor. These motors have high performance, but their control requirement impose a precise knowledge of the rotor angular position. Rotor position sensor (RPS) are traditionally designed using ... 詳細を見る
Nowadays, designing ever more efficient power modules requires complex materials and more innovative methodologies. To significantly reduce the lead time of the devices and decrease the costs, especially during the prototyping and the testing phases, a Finite Element Analysis (FEA) can ... 詳細を見る
As part of its research, the Group of Electrical Engineering – Paris (GeePs) uses the COMSOL Multiphysics® software for applications such as material modelling in Electrical Engineering, electromagnetic compatibility and electromagnetic non-destructive testing. Some problems involve ... 詳細を見る
The scaling down of Copper interconnects is an effective approach to increasing the number of signal I/O lines and performance in advanced fine-pitch packaging. However, as dimensions are reduced, the risk of electromigration-induced failures in the copper interconnects becomes ... 詳細を見る
