研究開発におけるマルチフィジックスシミュレーションの具体例
さまざまな業界のエンジニア, 研究者, 科学者がマルチフィジックスシミュレーションを使用して革新的な製品の設計とプロセスを研究および開発しています. COMSOL カンファレンスで発表したテクニカルペーパーやプレゼンテーションからインスピレーションを得てください. 以下の選択項目を参照するか, クイック検索ツールを使用して特定のプレゼンテーションを検索するか, アプリケーション領域でフィルタリングします.
COMSOL カンファレンス 2024 論文集を見る
Heat conduction problems can be divided into direct and inverse problems. In direct problems, the thermal boundary condition (heat flux or temperature) is given and its effect is calculated, while for inverse problems the boundary condition is determined based on its effect. For some ... 詳細を見る
Within the ENHANCE European project, hybrid energy harvesters have to be designed and developed to supply small and autonomous sensors in automobiles. The focus of this work is particularly related to the harvesting of energy from the vibration of the vehicle and from the high ... 詳細を見る
COMSOL Multiphysics® is a universal software complex based on the finite element method for computer modeling of physical problems. When modeling the electron beam processing process using the COMSOL Multiphysics® software complex, a number of parameters must be taken into account: 1. ... 詳細を見る
Metal Additive Manufacturing (AM) can be used to create topologically complex designs that would otherwise be difficult or impossible to produce using traditional methods. However, non-destructive inspection and testing of these structures is made difficult by the presence of internal or ... 詳細を見る
As additive manufacturing for metallic material is more and more used in industry, researchers try to overcome the limits of the process. To improve this industrial process, in terms of applications and understanding, the numerical simulation is today a very strong tool. Nevertheless, ... 詳細を見る
Verification for thermal performance of battery stack system is of critical importance during the design stage of any energy management system. The temperature of batteries during charging and discharging cycles should not exceed a permissible value. In current analysis work, ... 詳細を見る
In modern days one of the biggest challenges is to have a special connector for very high current power supply which shouldn’t exceed the rating temperature of 90°C at full load. This main challenge it to design special connectors of aluminum (Al). In this study, a new approach is ... 詳細を見る
Injection molding is one of the most diffused processes for mass production of polymeric components. It is adopted in many fields, from the automotive one to the biomedical field. The aspects related to environmental pollution make mandatory the reduction of plastic wastes, especially ... 詳細を見る
Temperature management and homogeneity on wafers has always an important effect on production in all microelectronics fields. The heat resistance of every mechanical contact, not only clamping, may decrease the precision of temperature regulation. But they also increase the difficulties ... 詳細を見る
Simulative Development of a Convectively Cooled Heat Sink for a Heat Pipe Mould-Element Corresponding Author: mhuettemann@fh-bielefeld.de The FH Bielefeld has developed an injection mold in which a lateral slide is tempered by heat pipes instead of conventional cooling channels. The ... 詳細を見る