研究開発におけるマルチフィジックスシミュレーションの具体例
さまざまな業界のエンジニア, 研究者, 科学者がマルチフィジックスシミュレーションを使用して革新的な製品の設計とプロセスを研究および開発しています. COMSOL カンファレンスで発表したテクニカルペーパーやプレゼンテーションからインスピレーションを得てください. 以下の選択項目を参照するか, クイック検索ツールを使用して特定のプレゼンテーションを検索するか, アプリケーション領域でフィルタリングします.
COMSOL カンファレンス 2024 論文集を見る
Modelling 3D IC structures with Through Silicon Vias (TSVs) and micro bumps is a promising technique to achieve “more than Moore” integration. Conventionally, Copper (Cu) is used as a TSV material. However, due to rapid scaling of interconnect, problems like electro-migration and surface ... 詳細を見る
Lyophilization is a dehydration process used to preserve perishable material like food. It depends on many parameters like temperature, pressure, rate of drying, type of heating for sublimation, chamber size etc. Therefore, optimization of multiple parameters is required for design and ... 詳細を見る
Laser material processing at micro-meter domain can be used for a plethora of applications such as micro drilling, micro welding, micro cutting, micro-texturing as well as micro polishing. These processes are governed by the time varying, complex melt hydrodynamics courtesy of melting ... 詳細を見る
An accelerometer detects acceleration and tilt of a device. There are several areas where accelerometers are in use, e.g. aerospace, navigation, automotive industry, electronic gadgets etc. According to different working principle, there are different types of accelerometer, e.g. piezo ... 詳細を見る
This paper presents numerical investigation of electronic thermal control using heat sink for integrated circuit (IC) chip cooling under forced convection in a horizontal channel. Steady state, three dimensional, incompressible, laminar forced convection cooling of chip attached with ... 詳細を見る
This paper presents numerical investigation on heated blocks under natural convection in a vertical channel for heat transfer enhancement. Three dimensional, steady state, incompressible, laminar natural convection in a vertical channel have been studied. The problem is modeled and ... 詳細を見る
This paper investigates numerical simulation of electronic chips mounted on substrate of multilayer copper clad board (k = 40.5 W/m K) in a horizontal channel under laminar forced convection. The heat sinks made of aluminum ( k = 160 W/m K) is attached to the silicon chips in order to ... 詳細を見る
Working performance of an disconnector is affected by maximum permissible temperature which is caused by the ohmic heat losses of & eddy current losses. Since experimental testing is expensive & time consuming, a 3D thermal analysis model of double break rotating blade (DBRB) 33 ... 詳細を見る
Thermophysical measurements of the Moon gained importance in light of recent results from various instruments onboard lunar missions such as LRO, GRAIL and Chandrayaan-1. Although heat flow measurements will be of top priority for future in situ geophysical exploration of the Moon, no ... 詳細を見る
Additive manufacturing is attracting more and more interest. Laser Cladding is one of these additive manufacturing processes. As it is a blown powder process, here a melt pool formation & fusion by moving the laser beam, into which powder is blown and molten & surface tension gradient ... 詳細を見る