研究開発におけるマルチフィジックスシミュレーションの具体例
マルチフィジックスモデリングとシミュレーションは, 産業界や学術界のさまざまな分野でイノベーションを推進しています. そのことは, 毎年 COMSOL Conference でエンジニア, 研究者, 科学者が発表する技術論文やポスターで紹介される数多くの活用事例からも明らかです. 以下にまとめられた最近の講演論文集から新たなアイデアやヒントを得たり, クイック検索ツールを使用して特定の発表を検索したり, アプリケーション分野, カンファレンスの開催年や開催地で絞り込んだりできます.
COMSOL Conference 2026 論文集を見る
The Dirac equation is employed in particle physics and historically gave the first combined unification of quantum mechanics and relativity theory by introducing a four component wave function Ψn n=1…4. This wave function describes the behavior of fermion type particles. The effect of a ... 詳細を見る
This paper deals with the numerical simulation of Annular Linear Induction Pump (ALIP) using Finite Element Method based software COMSOL Multiphysics® . ALIP is used for pumping of liquid sodium in various experimental facilities and in auxiliary circuits of fast reactors. Usually, the ... 詳細を見る
COMSOL®, like other finite element analysis software, enables analysis of an object of given geometry, material properties, boundary conditions, and loading. In this paper, we present a synthesis module for a class of structures called shallow bistable arches. Bistable arches have two ... 詳細を見る
Measuring soil moisture content plays an important role not only for sustaining dry farming but also for soil mapping. Our work includes developing a soil moisture sensor which is based on the principle of the Dual-Probe Heat-Pulse method to measure soil moisture content. To validate ... 詳細を見る
Optimal design and development of a machine tool structures have great influence on the precision of the machine tool's operations. The present work involves the design optimization of cast iron made CNC Spindle head for minimum overall compliance and the minimum weight of structural ... 詳細を見る
Undesirable shocks and vibrations are a noteworthy issue in numerous human exercises and domains. Therefore, various damping techniques are used to minimise vibrations, can be classified as active, Semi-active and passive damping. The development of semi-actively controlled ... 詳細を見る
Modelling 3D IC structures with Through Silicon Vias (TSVs) and micro bumps is a promising technique to achieve “more than Moore” integration. Conventionally, Copper (Cu) is used as a TSV material. However, due to rapid scaling of interconnect, problems like electro-migration and surface ... 詳細を見る
Lyophilization is a dehydration process used to preserve perishable material like food. It depends on many parameters like temperature, pressure, rate of drying, type of heating for sublimation, chamber size etc. Therefore, optimization of multiple parameters is required for design and ... 詳細を見る
