研究開発におけるマルチフィジックスシミュレーションの具体例
さまざまな業界のエンジニア, 研究者, 科学者がマルチフィジックスシミュレーションを使用して革新的な製品の設計とプロセスを研究および開発しています. COMSOL カンファレンスで発表したテクニカルペーパーやプレゼンテーションからインスピレーションを得てください. 以下の選択項目を参照するか, クイック検索ツールを使用して特定のプレゼンテーションを検索するか, アプリケーション領域でフィルタリングします.
COMSOL Conference 2024 論文集を見る
Micro-transfer printing (MTP) enables mass-transfer of wafer-level chips having lateral dimensions ranging from 3 x 7 um to 650 x 650 um to a nonnative substrate. This is accomplished with an elastomeric stamp containing micrometer scale posts that have been precisely defined using ... 詳細を見る
Wooden sculptures are an important part of European cultural heritage, but they are also among the most vulnerable objects to variations of temperature and relative humidity (RH). Fluctuations in the ambient environment can lead to irreversible structural and aesthetical damage. The ... 詳細を見る
The magnetron is one of the oldest and the most popular of the vacuum tubes. As they are very robust, low cost and highly efficient source of high-power microwaves, they have been a common choice for defence, medical, industrial and commercial applications. This work presents the ... 詳細を見る
The Finite Element Model is analyzed with impounded water considering appropriate boundary conditions between the water & the upstream face of the dam .The fluid on the upstream side is considered to be incompressible, inviscous, and irrotational. Here the effect of fluid ... 詳細を見る
Technologies based on micro electro mechanical systems (MEMS) present advantages for rheological applications as they enable the fabrication of smaller sensors with faster response times. In this work we propose fabrication parameters and simulation of a MEMS viscometer. This research ... 詳細を見る
Introduction Leaky Surface Acoustic Wave (LSAW) resonators in rotated Y-X cut Lithium Tantalate (LiTaO3) are widely used for resonator based ladder filters in telecommunication applications. These devices make use of quasi- shear waves confined to the surface of the piezoelectric layer ... 詳細を見る
Modelling 3D IC structures with Through Silicon Vias (TSVs) and micro bumps is a promising technique to achieve “more than Moore” integration. Conventionally, Copper (Cu) is used as a TSV material. However, due to rapid scaling of interconnect, problems like electro-migration and surface ... 詳細を見る
The primary enclosure of an injected formulation is almost exclusively comprised of a glass container (syringe) and an elastomer closure (i.e. plunger). A failed injection is anything that prevents the full dosage of the drug to be administered, whether that is a glass breakage or ... 詳細を見る
This paper presents a finite element (FE) model of the scattering studies of cylindrical pressure housings made of different metallic alloys such as aluminium, stainless steel 316L and titanium. Understanding the acoustic scattering behavior of underwater objects helps in improving ... 詳細を見る
This research delves into an in-depth stress load analysis of suspension clamp assemblies employed within the realm of railway overhead electrification (OHE). These suspension clamp assemblies play a crucial role in securing catenary wires of varying diameters. They encounter diverse ... 詳細を見る