研究開発におけるマルチフィジックスシミュレーションの具体例
マルチフィジックスモデリングとシミュレーションは, 産業界や学術界のさまざまな分野でイノベーションを推進しています. そのことは, 毎年 COMSOL Conference でエンジニア, 研究者, 科学者が発表する技術論文やポスターで紹介される数多くの活用事例からも明らかです. 以下にまとめられた最近の講演論文集から新たなアイデアやヒントを得たり, クイック検索ツールを使用して特定の発表を検索したり, アプリケーション分野, カンファレンスの開催年や開催地で絞り込んだりできます.
COMSOL Conference 2026 論文集を見る
This work presents a comprehensive modeling and validation study of MEMS-based infrared (IR) emitter chips using a neural network-assisted inverse modeling approach in COMSOL Multiphysics. Starting from a single baseline chip geometry, a simulation model was developed that captures the ... 詳細を見る
Microfluidic systems traditionally rely on fixed physical barriers to manipulate fluids and particles. While effective, these static structures lack the flexibility required for dynamic or multifunctional applications. In this work, recently published in Nature Photonics [1], we present ... 詳細を見る
Retention force and its frictional contribution influence on the plug-socket connection stability Aikaterini Tziotziou*, Oleg Antoniuk, Bas Haayen, Michele Colloca Receiver and RIC Development Department, Modeling and Simulation Team, Sonion Nederland, B.V. The plug-socket connection ... 詳細を見る
The thermo-hydraulically coupled code COMSOL-VIPER (Kröhn and Fromme 2023) based on the balance equations of the experimental VIPER code (Kröhn 2011) for simulating water uptake by bentonite has been further advanced. Bentonite is of particular interest as a geotechnical barrier against ... 詳細を見る
Stray light represents a significant challenge in a wide range of photodiode and photodiode array applications, as it elevates the background signal, reduces detector sensitivity, and degrades the signal-to-noise ratio. Traditional approaches to mitigate stray light, such as blackening ... 詳細を見る
This study presents a combined simulation and experimental investigation of mixing performance in a batch mixer, with the goal of validating simulation results and identifying optimization potential. The focus is on evaluating mixing times and flow fields to enhance process efficiency, ... 詳細を見る
The transfer molding process is a widely used method for encapsulating microelectronics and power semiconductor devices. In power electronics, it is gaining increasing importance, particularly in the automotive sector [1]. In transfer molding, an epoxy mold compound (EMC) is injected ... 詳細を見る
With the Creation, roll-out, and maintenance of COMSOL Simulation apps, the role of simulation engineers and departments is expanding to include responsibilities similar to those of software developers. Within our department, we have undergone this transformation and will share the key ... 詳細を見る
