研究開発におけるマルチフィジックスシミュレーションの具体例
さまざまな業界のエンジニア, 研究者, 科学者がマルチフィジックスシミュレーションを使用して革新的な製品の設計とプロセスを研究および開発しています. COMSOL カンファレンスで発表したテクニカルペーパーやプレゼンテーションからインスピレーションを得てください. 以下の選択項目を参照するか, クイック検索ツールを使用して特定のプレゼンテーションを検索するか, アプリケーション領域でフィルタリングします.
COMSOL カンファレンス 2024 論文集を見る
In this work the implementation of an optimization method [1, 2] for inverse heat transfer and for the sensor position correction, such as thermocouples, in COMSOL Multiphysics®and LiveLink™ for MATLAB® is presented. The inverse method is used to determine the unknown boundary condition ... 詳細を見る
Heat conduction problems can be divided into direct and inverse problems. In direct problems, the thermal boundary condition (heat flux or temperature) is given and its effect is calculated, while for inverse problems the boundary condition is determined based on its effect. For some ... 詳細を見る
The use of numerical techniques in PEM fuel cell sensoring represents an advantage of project engineering, reducing the costs and accelerating the manufacturing of prototypes. In this work some numerical responses are shown, relating to numerical sensoring of water and oxygen mole ... 詳細を見る
This paper presents a 3D finite element model in COMSOL for the electro-thermal analysis of high power light emitting diodes (LEDs). The proposed model and implementation approach require basic electrical and optical parameters that may be experimentally derived with the aid of advanced ... 詳細を見る
The measurement and regulation of particulate matter to improve outside air quality advanced a lot over the last decades. This also made it necessary to develop primary standards for calibrating these measurement systems and in future the composition of relevant aerosols will be taken ... 詳細を見る
The current drive to go beyond the state of the art in novel near field scanning microwave microscope (NSMM) metrology at the micro scale, to make them capable of traceable measurements on functional materials, has led to the development of a finite element model of the probe of a ... 詳細を見る
Two-component adhesives are commonly used for sealing and joining in transport applications for mechanically highly stressed connections. At the Chemnitz University of Technology an innovative system technology for the user-friendly, wireless and energy-efficient processing of two ... 詳細を見る
Induction furnace plays a very important role in the melting of high metal & metallic alloys. This furnace has an ability to quickly and efficiently heating of the material without being in physical contact. Such kind of heating mechanisms offers appropriate technology solutions to many ... 詳細を見る
In this work we investigate a wet-chemical silicon etching process. COMSOL Multiphysics® is used to extract local pressure values to correlate them to experimental results. The test setup consists of a box with a fixed wafer and a nozzle that injects an etchant jet onto the wafer ... 詳細を見る
The Purpose of this paper is to develop a thermal model using COMSOL Multiphysics® software that aims to get an idea of the heat flow around the ASIC, as well as to address the thermal issues for integrated circuits at the tongue board. However, we need sources of heat simulations to map ... 詳細を見る