William T. Vetterling, Zink Imaging, MA, USA
William Vetterling, research fellow and manager of the Image Science Laboratory at Zink Imaging, created an intuitive and easy-to-use simulation app that computes the current distribution and heating throughout a thermal print head design and displays the computed results in a clear, uncluttered way. The app was built with the Application Builder tool available within COMSOL Multiphysics®.
Vetterling built the app by selecting inputs for the number of electrodes in the print head and their width. He expanded the app's functionality with the Form Editor and Method Editor tools. The app can be deployed to colleagues with COMSOL Server™.
Suggested Stories
Keynote: Using COMSOL Multiphysics® for Circuit Board Thermal Analysis
The aerospace and defense industry requires stronger circuit boards than those needed for everyday electronics due to ...
Designing Next-Generation CO2 Removal Technology for Better Life in Space
NASA combines thermal modeling and experimental testing to find the best compressor design for the system that keeps ...
Modeling Inertial Focusing in Straight and Curved Microfluidic Channels
In many medical procedures and tests, it is necessary to isolate cells of interest for further analysis. Microfluidics ...
Magnetic Transmissions Increase Lifespan of Offshore Wind Farms
Sintex is a developer and manufacturer of magnetic couplings, systems that transmit torque and power with ...
