William T. Vetterling, Zink Imaging, MA, USA
William Vetterling, research fellow and manager of the Image Science Laboratory at Zink Imaging, created an intuitive and easy-to-use simulation app that computes the current distribution and heating throughout a thermal print head design and displays the computed results in a clear, uncluttered way. The app was built with the Application Builder tool available within COMSOL Multiphysics®.
Vetterling built the app by selecting inputs for the number of electrodes in the print head and their width. He expanded the app's functionality with the Form Editor and Method Editor tools. The app can be deployed to colleagues with COMSOL Server™.
Suggested Stories
Switching Made Easy
Modern cars offer a wide range of complex functionality that comes with several design challenges. This story ...
都市中心部の緑化: 庭の柵の中の都市型屋上排水システム
シミュレーションコンサルタントである TL-Engineering は, 教授, 土木技師, 防音壁会社と協力して, コペンハーゲン近郊の雨水オーバーフローと騒音公害を軽減するのに役立つ持続可能な都市型排水システム (SUDS) ...
Understanding the Origin of Uncertainty in Thermometer Calibration
Thermometers have widespread application and like any measurement device, they must be calibrated. Many do this with ...
Simulation Apps Advance Tribology Research
Modeling thermal elastohydrodynamically lubricated (TEHL) gear contacts quickly reveals a complex system of ...
