Keynote: App for the Thermal Simulation of Power Electronics Test Devices

Name: Keynote: App for the Thermal Simulation of Power Electronics Test Devices
Uploaded: 2026-09-04 13:31:38
Duration: 21 min 2 s
Description: Watch this keynote talk to learn how KAI GmbH developed a custom simulation app that enables users to evaluate microelectronic chip temperatures without prior simulation experience.

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所要時間: 21:02

概要
Transcript

In this keynote talk from COMSOL Day: Simulation Apps & Digital Twins, Daniel Tscharnuter of KAI GmbH presents a custom simulation app that enables users to ascertain thermal loading on the metallization layers of microelectronic test chips. The presentation includes an application example exploring the measurement of metallization delamination due to repetitive thermal overloading and concludes with a demonstration in the app showcasing key features.

Next Steps:

Learn more about electronic chip cooling with this tutorial model in the Application Gallery.
See other examples of how the power electronics industry uses simulation. Daniel Tscharnuter is principal engineer in Modeling & Simulation at KAI. He holds a master’s degree in engineering physics and a PhD in polymer science and engineering and has expertise in material modeling.