アプリケーションギャラリには電気, 構造, 音響, 流体, 熱および化学分野に関連する COMSOL Multiphysics® チュートリアルおよびデモアプリファイルが用意されています. これらの例はチュートリアルモデルまたはデモアプリファイルとそれに付随する手順をダウンロードすることにより独自のシミュレーション作業の開始点として使用できます.
クイック検索機能を使用して専門分野に関連するチュートリアルやアプリを検索します. MPHファイルをダウンロードするには, ログインするか, 有効な COMSOL ライセンスに関連付けられている COMSOL Access アカウントを作成します. ここで取り上げた例の多くは COMSOL Multiphysics® ソフトウェアに組み込まれ ファイルメニューから利用できるアプリケーションライブラリからもアクセスできることに注意してください.
This tutorial demonstrates how to build the geometry for the 3D biased resonator from GDS file using the ECAD Import Module and the Design Module. The procedure emulates semiconductor and MEMS fabrication processes to build 3D geometry more efficiently and is more intuitive for those ... 詳細を見る
The suspension of a loudspeaker is designed to keep the membrane in place and avoid any rocking movement of the voice coil. At low frequencies, where the displacement of the membrane is significant, the stiffness of the suspension varies along the movement of the voice coil. This ... 詳細を見る
Extending the High Voltage Insulator model, this example shows how to set up an Optimization Study to determine the optimum position of the grading rings to obtain the highest flashover voltage. 詳細を見る
A spherical water-rich load (potato) is placed on the rotating glass tray of a microwave oven some distance from the center of rotation. 1 kW of 2.45 GHz microwave power is applied via a waveguide feed. The plate rotates at 9 degrees per second. The heat transfer model involves the ... 詳細を見る
This benchmark model simulates a graded heterojunction using the thermionic emission formulation for the charge transfer over the junction. It shows the additional contribution to the current density from the quantum tunneling effect across the potential barrier, using the WKB ... 詳細を見る
This tutorial explores how pulse reverse plating can be used as an additive-free alternative to attenuate small protrusions during copper metal deposition. By matching the process parameters, including the length of the forward and reverse pulses (duty cycles), a bright mirror-like metal ... 詳細を見る
This tutorial model analysis of a microstrip patch antenna shows how to couple the finite element method (FEM) to the boundary element method (BEM) for evaluating the field outside the FEM computational domain. The model computes the S-parameter, near-field distribution, and far-field ... 詳細を見る
This model demonstrates the use of moving meshes in the application of copper electrodeposition on circuit boards. In these environments, the presence of cavities or 'trenches' are apparent. The model makes use of the Tertiary, Nernst-Planck interface for electrodeposition to keep track ... 詳細を見る
This app demonstrates the following: Visualizing material appearance, color, and texture Showing info below the graphics about geometry parameters, results and performance depending on the selected plot action Thermoelectric coolers are widely used for electronics cooling in various ... 詳細を見る
