D2W simulation

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Hello!

I am currently trying to modify the official COMSOL die-to-wafer (D2W) bonding example. In my modified model, I have increased the thickness of the upper die to match the thickness of the lower wafer, while keeping all other physics settings unchanged.

So far, I have performed parametric sweeps of the initial warpage, bonding time, and downward displacement. However, the bonded area remains very small in all cases.

My question is: How can I modify the model to ensure that the upper die, after increasing its thickness, can undergo the same bonding process as in the original model with the thinner upper die? Are there any additional adjustments needed to the physical settings, boundary conditions, contact definitions, or solver configurations to account for the increased thickness and bending stiffness?

I would greatly appreciate any suggestions or guidance. Thank you very much for your time and help!


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