アプリケーションギャラリには電気, 構造, 音響, 流体, 熱および化学分野に関連する COMSOL Multiphysics® チュートリアルおよびデモアプリファイルが用意されています. これらの例はチュートリアルモデルまたはデモアプリファイルとそれに付随する手順をダウンロードすることにより独自のシミュレーション作業の開始点として使用できます.
クイック検索機能を使用して専門分野に関連するチュートリアルやアプリを検索します. MPHファイルをダウンロードするには, ログインするか, 有効な COMSOL ライセンスに関連付けられている COMSOL Access アカウントを作成します. ここで取り上げた例の多くは COMSOL Multiphysics® ソフトウェアに組み込まれ ファイルメニューから利用できるアプリケーションライブラリからもアクセスできることに注意してください.
Chemical mechanical polishing (CMP) is a crucial technique for surface planarization, widely used in semiconductor fabrication and optical device manufacturing. This model simulates the flow field within the CMP retaining ring and tracks the motion of abrasive particles carried by the ... 詳細を見る
This example demonstrates simulation of a turbulent flow in a geometry with an air filter. Porous material of the filter induces an abrupt pressure drop and drastic increase of turbulence level inside the filter. 詳細を見る
This model how to build and solve a conductive heat transfer problem using the Heat Transfer interface. The model, taken from a NAFEMS benchmark collection, shows an axisymmetric steady-state thermal analysis. As opposed to the NAFEMS benchmark model, we use the temperature unit kelvin ... 詳細を見る
This model solves the fluid flow and heat transfer in a micro heat exchanger made of stainless steel. These types of heat exchangers are found in lab-on-chip devices in biotechnology and micro reactors, for example for micro fuel cells. The model takes heat transferred through both ... 詳細を見る
This model is an introduction to defining and verifying a satellite orbit, and computing the solar, albedo, and Earth infrared thermal loads. A 1U CubeSat is in a circular orbit at 400km altitude, inclination of 50°, and longitude of ascending node of 0°. The satellite is rotating slowly ... 詳細を見る
In the semiconductor industry, rapid thermal annealing (RTA) is a semiconductor process step used for the activation of dopants and the interfacial reaction of metal contacts. In principle, the operation involves rapid heating of a wafer from ambient to approximately 1000–1500 K. As soon ... 詳細を見る
This tutorial shows how to use the Surface-to-Surface Radiation interface to simulate radiative heat transfer with radiation between diffuse emitters and diffuse-and-specular reflectors. This model is separated in two parts. The first part focuses on a validation test for the radiative ... 詳細を見る
Modeling curing is important in a wide variety of applications such as for devices utilizing polymer materials, rubber materials, plastics, and concrete. Curing is usually an exothermic reaction. In the current example, curing of butyl rubber is studied in a 3D mold for an automotive ... 詳細を見る
This model demonstrates the application of COMSOL Multiphysics to a benchmark case of steady-state subsurface fluid flow and transient solute transport along a vertical cross section in an unconfined aquifer. Because of profound geologic heterogeneity, the model must estimate solute ... 詳細を見る
This model simulates a static analysis of heat conduction in a thin conductive shell. This is a benchmark model where the result is compared with a NAFEMS benchmark solution. 詳細を見る
