アプリケーションギャラリには電気, 構造, 音響, 流体, 熱および化学分野に関連する COMSOL Multiphysics® チュートリアルおよびデモアプリファイルが用意されています. これらの例はチュートリアルモデルまたはデモアプリファイルとそれに付随する手順をダウンロードすることにより独自のシミュレーション作業の開始点として使用できます.
クイック検索機能を使用して専門分野に関連するチュートリアルやアプリを検索します. MPHファイルをダウンロードするには, ログインするか, 有効な COMSOL ライセンスに関連付けられている COMSOL Access アカウントを作成します. ここで取り上げた例の多くは COMSOL Multiphysics® ソフトウェアに組み込まれ ファイルメニューから利用できるアプリケーションライブラリからもアクセスできることに注意してください.
The acoustic field in a model of an axially symmetric lined aero-engine duct, based on modal sound transmission, is analyzed. The source is generated by a single mode excitation at a boundary. Sources and nonreflecting conditions are applied using port boundary conditions. The model ... 詳細を見る
A surface acoustic wave (SAW) is an acoustic wave propagating along the surface of a solid material. Its amplitude decays rapidly, often exponentially, through the depth of the material. SAWs are utilized in many kinds of electronic components, including filters, oscillators, and ... 詳細を見る
This model shows how to use the scattered field formulation to compute the transmission coefficient for impinging P and S plane elastic waves onto a finite size phononic crystal. The transmission tends to zero in the frequency range corresponding to P- and S-wave band gaps, as ... 詳細を見る
This is a conceptual model illustrating how to couple fluid-structure interaction, heat transfer, and thermal expansion. A bimetallic strip in an air channel is heated so that it bends. After some time, an airflow with an inlet temperature which varies in time is introduced. As a ... 詳細を見る
When simulations are involved in the development of mobile devices, consumer electronics, hearing aids, or headsets, it is necessary to consider how the transducers interact with the rest of the system. Here, we show an analysis of the interaction between a vibration isolation mounting ... 詳細を見る
The Highly Accelerated Stress Test (HAST) is a testing technique to precipitate failure of electronic devices under elevated temperature and high humidity environment. This model demonstrates the structural analysis of a plastic encapsulated IGBT module under the HAST testing condition. ... 詳細を見る
It is often not possible to insert a normal microphone directly into the sound field being measured. The microphone may be too big to fit inside the measured system, such as for in-the-ear measurements for hearing aid fitting. The size of the microphone may also be too large compared to ... 詳細を見る
Reflow soldering is an important process in IC packaging. In reflow soldering, the solder materials are melted to create joints between electrical components and the PCBs for structural and electrical connections. This model demonstrates the process of attaching chips to a PCB by reflow ... 詳細を見る
This is a tutorial example, showing how to work with pretensioned bolts. Various aspects of bolt modeling are explored: Modeling bolts as solids or by beams Connections of beams to solid components Bolts ended by nuts or by internal threads in the attached component Import of bolt and ... 詳細を見る
Crimping is the plastic deformation process used to form an electrical joint between a stranded conductor and a terminal. The process involves complex multi-surface contact, including self-contact, as the terminal sleeve is plastically deformed around the wire strands. This example ... 詳細を見る
