アプリケーションギャラリには電気, 構造, 音響, 流体, 熱および化学分野に関連する COMSOL Multiphysics® チュートリアルおよびデモアプリファイルが用意されています. これらの例はチュートリアルモデルまたはデモアプリファイルとそれに付随する手順をダウンロードすることにより独自のシミュレーション作業の開始点として使用できます.
クイック検索機能を使用して専門分野に関連するチュートリアルやアプリを検索します. MPHファイルをダウンロードするには, ログインするか, 有効な COMSOL ライセンスに関連付けられている COMSOL Access アカウントを作成します. ここで取り上げた例の多くは COMSOL Multiphysics® ソフトウェアに組み込まれ ファイルメニューから利用できるアプリケーションライブラリからもアクセスできることに注意してください.
In direct bonding, the in-plane relative displacement between corresponding points on the bonding surfaces of the top and bottom wafers, denoted as IPD (In-Plane Distortion), is the primary yield killer in the bonding process. This model can predict the entire direct wafer bonding ... 詳細を見る
Through-silicon vias (TSVs) allow chips or wafers to be connected vertically, making TSV a crucial technology for 2.5D and 3D packaging. The basic structure of a TSV consists of a deep hole penetrating a silicon substrate, a filling metal (usually copper) in the deep hole, and an ... 詳細を見る
This example model demonstrates shape optimization of a cavity filter using the Transformation feature, so the boundaries remain flat and angles do not change. The optimization considers both insertion loss and out-of-band rejection. The optimized shape is verified using a different mesh ... 詳細を見る
This model demonstrates how to extract the lumped parameters for an mBVD equivalent circuit from a FEM simulation and how to leverage such a model directly using the Electrical Circuit interface. A 3D layered FBAR resonator is considered as an example. Related Blog Post Leveraging the ... 詳細を見る
Permanent magnet manufacturers test magnets by applying a cyclic temperature load during the design process to assess the resulting thermal demagnetization. The heating process is usually slow enough that the temperature distribution inside the magnet can be considered uniform at any ... 詳細を見る
Cascaded cavity filters provide much better bandpass filter performance than single cavity filters. This example demonstrate how to use shape optimization to optimize three rectangular cavity filters coupled via slots. The calculated S-parameters show excellent out-of-band rejection. 詳細を見る
Flip-chip (FC) is one of the advanced forms of semiconductor device packaging that is widely used in today's semiconductor packages for its capability to minimize packaging size while enhancing electrical interconnection density and transmission performance. In FC devices, the active ... 詳細を見る
This tutorial demonstrates how to import a GDS file to model a capacitive micromachined ultrasonic transducer (CMUT). It shows how to define the layer stackup by modifying layer thicknesses and elevations, and how to use the automatically generated layer and cell selections. The imported ... 詳細を見る
This example demonstrates how to use a boundary condition to model current flow along thin conductive layers. This is implemented within the Magnetic Field Formulation interface, which is well suited for considering nonlinear resistive constitutive relationships between the electric ... 詳細を見る
