アプリケーションギャラリには電気, 構造, 音響, 流体, 熱および化学分野に関連する COMSOL Multiphysics® チュートリアルおよびデモアプリファイルが用意されています. これらの例はチュートリアルモデルまたはデモアプリファイルとそれに付随する手順をダウンロードすることにより独自のシミュレーション作業の開始点として使用できます.
クイック検索機能を使用して専門分野に関連するチュートリアルやアプリを検索します. MPHファイルをダウンロードするには, ログインするか, 有効な COMSOL ライセンスに関連付けられている COMSOL Access アカウントを作成します. ここで取り上げた例の多くは COMSOL Multiphysics® ソフトウェアに組み込まれ ファイルメニューから利用できるアプリケーションライブラリからもアクセスできることに注意してください.
This model analyzes the electromagnetic, mechanical, and acoustical characteristics of the OWS-1943T-8CP (discontinued) speaker. Beside certain details, the geometry, material properties, and measurements are copyright by Ole Wolff. Starting from the geometry of the speaker, an ... 詳細を見る
Hydrogen embrittlement refers to the degradation of metal ductility due to the absorption of hydrogen. The metal becomes more brittle and thus cracks might initiate at lower stress levels. It is important to estimate hydrogen concentration and the speed at which it diffuses into the ... 詳細を見る
This tutorial shows how you can use the Electromechanics interface in COMSOL's MEMS Module to model Electrostriction. Electrostrictive materials (e.g. PMN-PT) exhibit nonlinear strain as a function of electric field. This 2D axisymmetry model uses a parametric sweep of voltage to ... 詳細を見る
This example demonstrates the wrinkling phenomenon in a thin sheet stretched uniaxially. The modified membrane theory, which incorporates the wrinkling model, ensures noncompressive principal stresses in the wrinkled region. The analytical results are compared to the numerical results. 詳細を見る
In this example, the deformation of a rubber boot seal connected to a rigid pipe is studied. As the pipe rotates and the seal deforms, the flanges of the seal self-intersect and it also come into contact with the pipe. 詳細を見る
This entry is a compilation of some examples from DIN EN 1991-1-2 (Actions on structures exposed to fire). Models that are included: 1. Cooling (HT) 2. Heating (HT) 3. Heat transfer through multiple layers (HT) 4. Thermal elongation (SME, thermal stress) 5. Thermal expansion (SME, HT, ... 詳細を見る
This model shows how to simulate a capacitively actuated surface micromachined accelerometer, using the Electromechanics Interface. It is based on a case study from the book Microsystem Design by Stephen D. Senturia (Kluwer Academic Publishers, 5th Edition, 2003, pages 513-525). 詳細を見る
Electronic equipment often has to be certified to function after having been subjected to a specified shock load. In this example, the effect of an 50g 11ms half sine shock on a circuit board is investigated using response spectrum analysis. The results are compared with a time domain ... 詳細を見る
This conceptual example shows how to calculate critical points in models with contact. The model consists of two contacting arches modeled with the Shell interface. The contact problem is solved using the penalty method. The upper arch is loaded with displacement controlled edge loads ... 詳細を見る
This example shows how to model Lithium diffusion in a silicon electrode that swells. The model shows how swelling-induced plastic deformation can increase the maximum state of charge (SOC). 詳細を見る
