アプリケーションギャラリには電気, 構造, 音響, 流体, 熱および化学分野に関連する COMSOL Multiphysics® チュートリアルおよびデモアプリファイルが用意されています. これらの例はチュートリアルモデルまたはデモアプリファイルとそれに付随する手順をダウンロードすることにより独自のシミュレーション作業の開始点として使用できます.
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A thermoelectric leg is a fundamental component of a thermoelectric cooler (or heater). For example, a thermocouple is a thermoelectric module typically made of two thermoelectric legs: one made of p-type and of one n-type semiconductor material which are connected in series electrically ... 詳細を見る
This example demonstrates a benchmark test showing that Electric Currents in Layered Shells physics interface can be used to obtain the same results as when the model is solved with the Electric Currents interface based on a solid 3D structure. 詳細を見る
This model simulates the shape evolution of a microconnector bump over time as copper deposits on an electrode surface. Transport of cupric ions in the electrolyte occurs by convection and diffusion. The electrode kinetics are described by a concentration dependent Butler-Volmer ... 詳細を見る
This problem follows a typical preliminary board-level thermal analysis. First perform a simulation of the board with some Integrated Circuits (ICs). Then, add a disk-stack heat sink to observe cooling effects. Finally, explore adding a copper layer to the bottom of the board in order to ... 詳細を見る
This tutorial example models the currents and the concentration of dissolved metal ions in a battery (corrosion cell) made from an orange and two metal nails. This type of battery is commonly used in chemistry lessons. Instead of an orange, lemons or potatoes can also be used. 詳細を見る
This model simulates atmospheric galvanic corrosion of a busbar, which includes a copper flange, an aluminum alloy flange in contact with a zinc nut and bolt. The Secondary Current Distribution interface is used to solve for the electric potential in electrode domain and Current ... 詳細を見る
A diplexer is a device that combines or splits signals into two different frequency bands, widely used in mobile communication systems. This model simulates splitting properties using a simplified 2D geometry. The computed S-parameters and electric fields at the lower and upper bands ... 詳細を見る
A surface mount resistor is subjected to thermal cycling. The difference in the thermal expansion of different materials will introduce stresses in the structure. The solder which connects the resistor with the printed circuit board is seen as the weakest link in the assembly. It ... 詳細を見る
This tutorial explores how pulse reverse plating can be used as an additive-free alternative to attenuate small protrusions during copper metal deposition. By matching the process parameters, including the length of the forward and reverse pulses (duty cycles), a bright mirror-like metal ... 詳細を見る
UHF RFID tags are widely used for identifying and tracking animals. This model simulates a passive radio-frequency identification (RFID) tag for the UHF frequency range. With respect to the chip transponder’s complex impedance, a reflection coefficient is computed. This is done using an ... 詳細を見る