アプリケーションギャラリには電気, 構造, 音響, 流体, 熱および化学分野に関連する COMSOL Multiphysics® チュートリアルおよびデモアプリファイルが用意されています. これらの例はチュートリアルモデルまたはデモアプリファイルとそれに付随する手順をダウンロードすることにより独自のシミュレーション作業の開始点として使用できます.
クイック検索機能を使用して専門分野に関連するチュートリアルやアプリを検索します. MPHファイルをダウンロードするには, ログインするか, 有効な COMSOL ライセンスに関連付けられている COMSOL アクセスアカウントを作成します. ここで取り上げた例の多くは COMSOL Multiphysics® ソフトウェアに組み込まれ ファイルメニューから利用できるアプリケーションライブラリからもアクセスできることに注意してください.
These models use the Discrete Ordinates method (DOM) and P1 approximation to solve a 3D radiative transfer problem in an emitting, absorbing, and linear-anisotropic scattering finite cylindrical medium. Using the S6 quadrature of DOM leads to accurate results, which are needed in ... 詳細を見る
In massive forming processes like rolling or extrusion, metal alloys are deformed in a hot solid state with material flowing under ideally plastic conditions. Such processes can be simulated effectively using computational fluid dynamics, where the material is considered as a fluid with ... 詳細を見る
The suite of models examine the air cooling of circuit boards populated with multiple integrated circuits (ICs), which act as heat sources. Two possible cooling scenarios are depicted: vertically aligned boards using natural convection, and horizontal boards with forced convection (fan ... 詳細を見る
This model simulates a temperature profile in a number of cells and cooling fins in a liquid-cooled battery pack. The model solves in 3D and for an operational point during a load cycle. A full 1D electrochemical model for the lithium battery calculates the average heat source. 詳細を見る
In the semiconductor industry, rapid thermal annealing (RTA) is a semiconductor process step used for the activation of dopants and the interfacial reaction of metal contacts. In principle, the operation involves rapid heating of a wafer from ambient to approximately 1000–1500 K. As soon ... 詳細を見る
All integrated circuits (ICs) — especially high-speed devices — produce heat. In today’s dense electronic system layouts, heat sources are many times placed close to heat-sensitive ICs. Designers of printed circuit boards often need to consider the relative placement of heat ... 詳細を見る
This is a model of an RF waveguide bend with a dielectric block inside. There are electromagnetic losses in the block as well as on the waveguide walls which cause the assembly to heat up over time. The material properties of the block are functions of temperature. The transient thermal ... 詳細を見る
This model illustrates how to implement a multiphysics contact. It models the thermal and electrical behavior of two contacting parts of a switch. The electrical current and the heat flow from one part to the other only through the contact surface. The contact switch device has a ... 詳細を見る
This example demonstrates how to use temperature dependent materials within the Nonlinear Structural Materials Module. A large container holds pressurized hot water. Several pipes are attached to the pressure vessel. Those pipes can rapidly transfer cold water in case of an emergency ... 詳細を見る
This example simulates the thermodynamical evolution of moist air in an electronic box with the aim of detecting whether condensation occurs when the external environment properties change. The model imports measured data for the air temperature, pressure, and water vapor concentration. ... 詳細を見る