アプリケーションギャラリ

The ball grid array (BGA) technology is a surface-mount technology widely used in electronic packaging. Usually, there are two types of solder balls considered in the array, including the functional balls that are required for electric connections and the support balls that are used only ... 詳細を見る

This example illustrates how to perform eigenfrequency and static analyses of a ladder frame structure for a light truck. Important modeling strategies are described. For example, how to convert a solid geometry to a shell model, how to make different types of connections, and how to ... 詳細を見る

This is a benchmark model involving stick-slip friction of a ring rolling inside another ring. The displacement of the inner ring is computed and compared to the analytical result. This model also shows how to tackle friction dominated contact problem. 詳細を見る

A cable is a structural member which has stiffness only in its tangential direction, but virtually no bending stiffness. When supported only at its two ends it deflects under gravitational load forming a curve known as catenary. This example shows how to model components such as cables, ... 詳細を見る

The reliability of a bike frame can be estimated by analyzing the structural stress subjected to different load cases. This app leverages LiveLink™ for SOLIDWORKS® to interactively update the geometry while computing stress analyses. Using this app, you can easily test different ... 詳細を見る

This example presents a homogenized model of a corrugated sheet based on a unit cell approach. The numerically obtained equivalent stiffness matrices are compared with various analytical models. Two corrugation profiles, trapezoidal and round, are considered in this example. 詳細を見る

This benchmark studies the nonlinear deformation of a spherical cap subjected to point load at center using 2D axisymmetric Solid Mechanics and Shell interfaces. The results from the Shell interface are compared with Solid Mechanics interface as well as with analytical results given in ... 詳細を見る

This model shows a full vibroacoustic analysis of a loudspeaker including driver, cabinet, and stand. It lets you apply a nominal driving voltage and extract the resulting sound pressure level in the cabinet and in the outside room, as well as the deformation of the cabinet and driver, ... 詳細を見る

This example reproduces a NAFEMS benchmark in which a plate with an angle crack is subjected to tensile loading. The J-integral is calculated and the stress intensity factors for Mode I and Mode II are compared to the benchmark results for several crack angles. 詳細を見る

Interference fit is a technique used to join or fit one part over or around another part. The internal part is cooled, so that it shrinks, and is then fitted. Once the part heats up again and expands, a contact pressure builds up at the interface between the two parts. This type of ... 詳細を見る