アプリケーションギャラリには電気, 構造, 音響, 流体, 熱および化学分野に関連する COMSOL Multiphysics® チュートリアルおよびデモアプリファイルが用意されています. これらの例はチュートリアルモデルまたはデモアプリファイルとそれに付随する手順をダウンロードすることにより独自のシミュレーション作業の開始点として使用できます.
クイック検索機能を使用して専門分野に関連するチュートリアルやアプリを検索します. MPHファイルをダウンロードするには, ログインするか, 有効な COMSOL ライセンスに関連付けられている COMSOL Access アカウントを作成します. ここで取り上げた例の多くは COMSOL Multiphysics® ソフトウェアに組み込まれ ファイルメニューから利用できるアプリケーションライブラリからもアクセスできることに注意してください.
In many structural dynamics applications, some components are stiff compared to the supporting structure. Such a stiff part will only contribute to the dynamic properties of the structure through its mass and moment of inertia. It is then possible to reduce the model size significantly ... 詳細を見る
This app demonstrates: Light theme This app allows you to evaluate cross-section data for a wide range of American and European standard beams. Given a set of forces and moments acting on the section, you can also compute a detailed stress distribution. Calculated cross-section data ... 詳細を見る
This model illustrates the instability of a space arc frame under concentrated vertical loading. The Beam interface is utilized. Two different approaches are used: A full incremental nonlinear analysis, where a small lateral load is applied to break the symmetry of the structure A ... 詳細を見る
The eigenfrequencies of a rotating blade are studied in this benchmark. It shows how stress stiffening and spin softening affect the fundamental eigenfrequency. High rotational speeds in rotating machinery can result in centrifugal forces of considerable magnitude. The forces induced by ... 詳細を見る
For slender structures, buckling can be a catastrophic instability if the service load exceeds the critical buckling load. For such structures, it can be important to study the structural behavior beyond the critical buckling load. Such a study is known as a postbuckling analysis. ... 詳細を見る
An acoustic point source emits a pressure wave in water that travels toward a piece of glass. Cracks are formed and propagate due to high tensile stresses developed in the glass. A fully coupled acoustic-structure interaction problem including phase field damage in solids is solved in ... 詳細を見る
The ball grid array (BGA) technology is a surface-mount technology widely used in electronic packaging. Usually, there are two types of solder balls considered in the array, including the functional balls that are required for electric connections and the support balls that are used only ... 詳細を見る
This example studies the deflection of a cantilever beam undergoing very large deflections. The beam is modeled using the Solid Mechanics, Shell, and Beam interfaces. The results are compared with each other and with a benchmark solution from NAFEMS. In addition, a linear buckling ... 詳細を見る
