COMSOL Conference 2026 Proceedings
プログラム委員会に採択された論文, ポスター, スライドショー
COMSOL Conference 2026 では, 世界中のエンジニア, 研究者, 科学者が, 主要な産業分野および学術界におけるモデリングとシミュレーションの活用事例を紹介しました. クイック検索ツールを使用して特定の発表を検索したり, トピックやイベント開催地での絞り込みができます.
Small-scale short-term thermal energy storage (TES) systems and large-scale seasonal TES systems have been the focus of many research projects. However, large-scale short-term TES units have not been covered in great depth, even though they play an important role by decoupling the heat ... 詳細を見る
Microalgae biomass is an essential part of the global ecosystem. Not only is it responsible for 50% of the global oxygen but also proved to be useful in the development of organic polymers, antioxidants, pharmaceuticals, and feedstocks for aquatic animals. It is considered as an ... 詳細を見る
In this work, we present a methodology for the design and analysis of a double-sided linear induction motor for a scaled Hyperloop pod in COMSOL Multiphysics®. The key aspects are discussed as follows: Formulation of problem and simulation environment: The goal is to design a Double ... 詳細を見る
Single droplet drying (SDD) is an established experimental set up in which an isolated droplet is dried under a controlled environment. The drying behavior in the SDD experiments is often complicated and challenged to observe. Hence, a robust model of single droplet drying can provide an ... 詳細を見る
The focus of this work is to determine the potential for arrays of nanoscale bowtie antennas for light enhancement and direction control in nano-optics devices. This is achieved by studying the effects of illumination on the backscattered and total fields, along with the intensity of the ... 詳細を見る
The presence of anthropogenic or natural pollutants in groundwater system poses a threat to water resources. Several remediation techniques have been explored and developed to decrease the concentration of contaminants. One such remediation technique, injection of nano-particles in the ... 詳細を見る
Interacting with digital devices has become part of daily life, whether in consumer products, services, or industrial applications. Most display-based devices provide user interactivity through touch sensing via a touch panel. As the number of device features increases, it demands an ... 詳細を見る
Plastic packages, coated with Epoxy Molding Compound (EMC) can provide an economic and versatile protection to the integrated circuits (IC) from mechanical damage. A major drawback of molded packages is that they are not hermetic and are prone to absorb moisture from external ... 詳細を見る
