研究開発におけるマルチフィジックスシミュレーションの具体例
マルチフィジックスモデリングとシミュレーションは, 産業界や学術界のさまざまな分野でイノベーションを推進しています. そのことは, 毎年 COMSOL Conference でエンジニア, 研究者, 科学者が発表する技術論文やポスターで紹介される数多くの活用事例からも明らかです. 以下にまとめられた最近の講演論文集から新たなアイデアやヒントを得たり, クイック検索ツールを使用して特定の発表を検索したり, アプリケーション分野, カンファレンスの開催年や開催地で絞り込んだりできます.
COMSOL Conference 2026 論文集を見る
The aim of this study is to evaluate the airflow thermal distribution inside a storehouse in different operational conditions. A warehouse of 12,600 m3 in volume is considered for fluid-dynamical and thermal analysis. Coupled Navier-Stokes and energy equations are solved considering or ... 詳細を見る
The throwing power is an important criterion for the industrial use of an electrolyte in electroplating applications. Using the Electrodeposition Module and COMSOL Multiphyiscs® it is possible to simulate the thickness distribution for various electroplating geometries. For a realistic ... 詳細を見る
To this day seamless accessibility of local or cloud hardware for high performance computing as well as time consuming workflows involving sequencing and orchestration of available hardware for multiple simulation runs, remain limiting factors within the field of Multiphysics simulation ... 詳細を見る
The aim of this investigation is to apply computational fluid dynamics simulations to support the design development of an impaction-based probe collector. This collector should allow submicron aerosol impactions in the supersonic free stream radially aside a sounding rocket body in the ... 詳細を見る
Over the past million years, several cold ages have occurred and thereby caused perma-frost conditions basically all over the present area of Germany. Since in Germany the safe-ty of a nuclear waste repository legally needs to be investigated for a period of one million years, the ground ... 詳細を見る
In this paper, we present a study of the simulation of Directed Energy Deposition (DED) Additive Manufacturing (AM) using a multiphysics approach. We use a combination of Heat Transfer in Fluids, Solid Mechanics and Laminar Flow physics to accurately simulate the DED process. The ... 詳細を見る
While copper remains the dominant material for conduction paths in printed circuit board (PCB) applications, both technological and economic reasons have been motivating research on substituting copper with aluminum (Al). Despite its 60 % higher specific electrical resistance, aluminum ... 詳細を見る
High power consumption chips have already become a major challenge for modern processors causing low thermal performances. Existing thermal solutions are not able to solve these high temperature issues efficiently. Two-phase cooling devices such as heat pipes and vapor chambers have ... 詳細を見る
